Organic light emitting display device and method of manufacturing the same

ABSTRACT

An organic light emitting display device includes a substrate including a light-emitting region and a reflection region, a plurality of sensing patterns disposed in the light-emitting region and the reflection region, and including a material having a first reflectivity, and a reflection pattern disposed in the reflection region, and including a material having a second reflectivity, and overlapping the plurality of sensing patterns.

This application claims priority to Korean Patent Application No.10-2015-0140248, filed on Oct. 6, 2015, and all the benefits accruingtherefrom under 35 U.S.C. § 119, the content of which in its entirety isherein incorporated by reference.

BACKGROUND

1. Field

Exemplary embodiments of the invention relate to an organic lightemitting display (“OLED”) device and a method of manufacturing the OLEDdevice. More particularly, exemplary embodiments relate to an OLEDdevice having a mirror function and a touch function, and a method ofmanufacturing the OLED device.

2. Description of the Related Art

A flat panel display (“FPD”) device is widely used as a display devicefor an electronic device due to its lightweight and thinness compared toa cathode-ray tube (“CRT”) display device. Typical examples of the flatpanel display device include a liquid crystal display (“LCD”) device andan organic light emitting diode (“OLED”) display device. Compared to theLCD, the OLED has many advantages such as a higher luminance and a widerviewing angle. In addition, the OLED display device can be made thinnerthan the LCD because the OLED display device does not require abacklight. In the OLED display device, electrons and holes are injectedinto an organic thin layer through a cathode and an anode, and thenrecombined in the organic thin layer to generate excitons, therebyemitting a light of a predetermined wavelength.

Recently, a mirror OLED device reflecting an image of an object (ortarget) that is located in the front of the OLED device by including areflective member has been developed. In addition, an OLED device havinga mirror function and a touch function has also been developed.

SUMMARY

In order to manufacture an organic light emitting display (“OLED”)device having a mirror function and a touch function, an additionalprocess for forming an electrode layer having a touch function iscommonly employed, thus increasing a manufacturing cost.

Exemplary embodiments of the invention provide an OLED device havingmirror function and touch function.

Exemplary embodiments of the invention also provide a method ofmanufacturing the OLED device.

In an exemplary embodiment of an OLED device according to the invention,the OLED device includes a substrate comprising a light-emitting regionand a reflection region, plurality of sensing patterns disposed in thelight-emitting region and the reflection region, and comprising amaterial having a first reflectivity and a reflection pattern disposedin the reflection region, and comprising a material having a secondreflectivity, and overlapping the sensing patterns.

In an exemplary embodiment, the OLED device may further include anopposite substrate facing the substrate. The sensing patterns may bedisposed on a first surface of the opposite substrate, the sensingpatterns may be disposed between the substrate and the oppositesubstrate, and the reflection pattern may be disposed on the sensingpatterns. The OLED device may further include an insulation layerdisposed between the sensing patterns and the reflection pattern, andcomprising an adhesive material.

In an exemplary embodiment, the reflection pattern may be electricallyconnected to the substrate through a conductive adhesive member.

In an exemplary embodiment, the OLED device may further include a thinfilm encapsulation layer disposed on the substrate. The sensing patternsmay be disposed on the thin film encapsulation layer, and the reflectionpattern may be disposed on the sensing patterns. The OLED device mayfurther include an insulation layer disposed between the sensingpatterns and the reflection pattern, and comprising an adhesivematerial.

In an exemplary embodiment, the OLED device may further include a firstthin film encapsulation layer disposed on the substrate. The sensingpatterns may be disposed on the first thin film encapsulation layer, andthe reflection pattern may be disposed on the sensing patterns. The OLEDdevice may further include a second thin film encapsulation layerdisposed between the sensing patterns and the reflection pattern.

In an exemplary embodiment, the sensing patterns may be classified as aplurality of sensing groups comprising a predetermined number of sensingpatterns of the plurality of sensing patterns. When a touch signal isapplied to the sensing patterns, a sensing group of the plurality ofsensing groups to which the touch signal is applied may be detected, andan accurate touch position in the sensing group to which the touchsignal is applied may be detected.

In an exemplary embodiment, when the touch signal is applied to thesensing group, a signal having the same signal as the touch signal maybe applied to the reflection pattern.

In an exemplary embodiment, the reflection pattern may include aplurality of sub-reflection patterns having an area corresponding to anarea of one sensing group of the plurality of sensing groups. When thetouch signal is applied to the sensing group, a signal having the samesignal as the touch signal may be applied to a sub-reflection patternoverlapping the sensing group to which the touch signal is applied

In an exemplary embodiment, the reflection pattern may include aplurality of sub-reflection patterns having an area corresponding to anarea of a predetermined number of sensing patterns of the plurality ofsensing patterns. The sub-reflection pattern may sense a touch positionof a wide range, and after the sub-reflection pattern senses the touchposition, the sensing pattern may sense an accurate touch position.

In an exemplary embodiment, the reflection pattern may include aplurality of sub-reflection patterns having an area corresponding to anarea of one sensing pattern. One sub-reflection pattern may beelectrically connected to one sensing pattern.

In an exemplary embodiment of a method of manufacturing an OLED deviceincluding a substrate comprising a light-emitting region and areflection region, the method includes forming a plurality of sensingpatterns comprising a material having a first reflectivity on thelight-emitting region and the reflection region and forming a reflectionpattern comprising a material having a second reflectivity on thereflection region, the reflection pattern overlapping the sensingpatterns.

In an exemplary embodiment, forming the sensing patterns and forming thereflection pattern may include forming the sensing patterns on a firstsurface of an opposite substrate facing the substrate, forming aninsulation layer on the sensing patterns and forming the reflectionpattern on the insulation layer. The sensing patterns and the reflectionpattern may be disposed between the substrate and the oppositesubstrate.

In an exemplary embodiment, the method may further include connectingelectrically the reflection pattern to the substrate by a conductiveadhesive member.

In an exemplary embodiment, forming the sensing patterns and forming thereflection pattern may include forming a thin film encapsulation layeron the substrate, forming the sensing patterns on the thin filmencapsulation layer, forming an insulation layer on the sensing patternsand forming the reflection pattern on the insulation layer.

In an exemplary embodiment, forming the sensing patterns and forming thereflection pattern may include forming a first thin film encapsulationlayer on the substrate, forming the sensing patterns on the first thinfilm encapsulation layer, forming a second thin film encapsulation layercomprising the same material as that of the first thin filmencapsulation layer on the sensing patterns and forming the reflectionpattern on the second thin film encapsulation layer.

In an exemplary embodiment, the sensing patterns may be classified as aplurality of sensing groups comprising a predetermined number of sensingpatterns of the plurality of sensing patterns. When a touch signal isapplied to the sensing patterns, a sensing group to which the touchsignal is applied may be detected, and an accurate touch position in thesensing group to which the touch signal is applied may be detected.

In an exemplary embodiment, when the touch signal is applied to asensing group, a signal having the same signal as the touch signal maybe applied to the reflection pattern.

In an exemplary embodiment, the reflection pattern may include aplurality of sub-reflection patterns having an area corresponding to anarea of one sensing group. When the touch signal is applied to a sensinggroup, a signal having the same signal as the touch signal may beapplied to a sub-reflection pattern overlapping, the sensing group towhich the touch signal is applied.

In an exemplary embodiment, the reflection pattern may include aplurality of sub-reflection patterns having an area corresponding to anarea of a predetermined number of sensing patterns of the plurality ofsensing patterns. The sub-reflection pattern may sense a touch positionof a wide range, and after the sub-reflection pattern senses the touchposition, the sensing pattern may sense an accurate touch position. Onesub-reflection pattern may be electrically connected to one sensingpattern.

In an exemplary embodiment, the reflection pattern may include aplurality of sub-reflection patterns having an area corresponding to anarea of one sensing pattern.

According to the exemplary embodiment, an OLED device includes areflection member having mirror function and touch function. Thus,additional process for forming an electrode layer having a touchfunction may be omitted. This, a manufacturing cost may be decreased.

In addition, the OLED device includes a first reflection member disposedin a reflection region and a second disposed in the light-emittingregion and the reflection region. Thus, scattered reflection occurred atan edge of the first reflection member may be decreased.

In addition, the OLED device includes a thin film encapsulation layer.Thus, a flexible OLED device having mirror function and touch functionmay be manufactured.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other features and advantages of the invention will becomemore apparent by describing in detailed exemplary embodiments thereofwith reference to the accompanying drawings, in which:

FIG. 1 is a plan view illustrating an exemplary embodiment of an organiclight emitting display (“OLED”) device according to the invention;

FIG. 2 is a cross-sectional view taken along line I-I′ of FIG. 1;

FIGS. 3 to 10 are cross-sectional views illustrating a method ofmanufacturing the OLED device of FIG. 2;

FIG. 11 is a plan view illustrating a reflection pattern of FIG. 2;

FIG. 12 is a plan view illustrating a sensing pattern of FIG. 2;

FIG. 13 is a plan view illustrating the reflection pattern of FIG. 11and the sensing pattern of FIG. 12;

FIG. 14 is a plan view illustrating a reflection pattern of FIG. 2;

FIG. 15 is a plan view illustrating a sensing pattern of FIG. 2;

FIG. 16 is a plan view illustrating the reflection pattern of FIG. 14and the sensing pattern of FIG. 15;

FIG. 17 is a plan view illustrating a reflection pattern of FIG. 2;

FIG. 18 is a plan view illustrating a sensing pattern of FIG. 2;

FIG. 19 is a plan view illustrating the reflection pattern of FIG. 17and the sensing pattern of FIG. 18;

FIG. 20 is a plan view illustrating a reflection pattern of FIG. 2;

FIG. 21 is a plan view illustrating a sensing pattern of FIG. 2;

FIG. 22 is a plan view illustrating the reflection pattern of FIG. 20and the sensing pattern of FIG. 21;

FIG. 23 is a plan view illustrating a reflection pattern of FIG. 2;

FIG. 24 is a plan view illustrating a sensing pattern of FIG. 2;

FIG. 25 is a plan view illustrating the reflection pattern of FIG. 23and the sensing pattern of FIG. 24;

FIG. 26 is a plan view illustrating an exemplary embodiment of an OLEDdevice according to the invention;

FIG. 27 is a cross-sectional view taken along line IV-IV′ of FIG. 26;

FIGS. 28 to 35 are cross-sectional views illustrating a method ofmanufacturing the OLED device of FIG. 27;

FIG. 36 is a plan view illustrating a reflection pattern of FIG. 27;

FIG. 37 is a plan view illustrating a sensing pattern of FIG. 27;

FIG. 38 is a plan view illustrating the reflection pattern of FIG. 36and the sensing pattern of FIG. 37;

FIG. 39 is a plan view illustrating a reflection pattern of FIG. 27;

FIG. 40 is a plan view illustrating a sensing pattern of FIG. 27;

FIG. 41 is a plan view illustrating the reflection pattern of FIG. 39and the sensing pattern of FIG. 40;

FIG. 42 is a plan view illustrating a reflection pattern of FIG. 27;

FIG. 43 is a plan view illustrating a sensing pattern of FIG. 27;

FIG. 44 is a plan view illustrating the reflection pattern of FIG. 42and the sensing pattern of FIG. 43;

FIG. 45 is a plan view illustrating an exemplary embodiment of an OLEDdevice according to the invention;

FIG. 46 is a cross-sectional view taken along line V-V′ of FIG. 45;

FIGS. 47 to 54 are cross-sectional views illustrating a method ofmanufacturing the OLED device of FIG. 46;

FIG. 55 is a plan view illustrating a reflection pattern of FIG. 46;

FIG. 56 is a plan view illustrating a sensing pattern of FIG. 46;

FIG. 57 is a plan view illustrating the reflection pattern of FIG. 55and the sensing pattern of FIG. 56;

FIG. 58 is a plan view illustrating an exemplary embodiment of an OLEDdevice according to the invention;

FIG. 59 is a cross-sectional view taken along line VI-VI′ of FIG. 58;

FIGS. 60 to 67 are cross-sectional views illustrating a method ofmanufacturing the OLED device of FIG. 59;

FIG. 68 is a plan view illustrating a reflection pattern of FIG. 59;

FIG. 69 is a plan view illustrating a sensing pattern of FIG. 59;

FIG. 70 is a plan view illustrating the reflection pattern of FIG. 68and the sensing pattern of FIG. 69;

FIG. 71 is a plan view illustrating a reflection pattern of FIG. 59;

FIG. 72 is a plan view illustrating a sensing pattern of FIG. 59;

FIG. 73 is a plan view illustrating the reflection pattern of FIG. 71and the sensing pattern of FIG. 72;

FIG. 74 is a plan view illustrating a reflection pattern of FIG. 59;

FIG. 75 is a plan view illustrating a sensing pattern of FIG. 59;

FIG. 76 is a plan view illustrating the reflection pattern of FIG. 74and the sensing pattern of FIG. 75;

FIG. 77 is a plan view illustrating a reflection pattern of FIG. 59;

FIG. 78 is a plan view illustrating a sensing pattern of FIG. 59;

FIG. 79 is a plan view illustrating the reflection pattern of FIG. 77and the sensing pattern of FIG. 78;

FIG. 80 is a plan view illustrating a reflection pattern of FIG. 59;

FIG. 81 is a plan view illustrating a sensing pattern of FIG. 59;

FIG. 82 is a plan view illustrating the reflection pattern of FIG. 80and the sensing pattern of FIG. 81;

FIG. 83 is a plan view illustrating an exemplary embodiment of an OLEDdevice according to the invention;

FIG. 84 is a cross-sectional view taken along line VII-VII′ of FIG. 83;

FIGS. 85 to 92 are cross-sectional views illustrating a method ofmanufacturing the OLED device of FIG. 84;

FIG. 93 is a plan view illustrating a reflection pattern of FIG. 84;

FIG. 94 is a plan view illustrating a sensing pattern of FIG. 84;

FIG. 95 is a plan view illustrating the reflection pattern of FIG. 93and the sensing pattern of FIG. 94;

FIG. 96 is a plan view illustrating a reflection pattern of FIG. 84;

FIG. 97 is a plan view illustrating a sensing pattern of FIG. 84;

FIG. 98 is a plan view illustrating the reflection pattern of FIG. 96and the sensing pattern of FIG. 97;

FIG. 99 is a plan view illustrating a reflection pattern of FIG. 84;

FIG. 100 is a plan view illustrating a sensing pattern of FIG. 84;

FIG. 101 is a plan view illustrating the reflection pattern of FIG. 99and the sensing pattern of FIG. 100;

FIG. 102 is a plan view illustrating a reflection pattern of FIG. 84;

FIG. 103 is a plan view illustrating a sensing pattern of FIG. 84;

FIG. 104 is a plan view illustrating the reflection pattern of FIG. 102and the sensing pattern of FIG. 103;

FIG. 105 is a plan view illustrating a reflection pattern of FIG. 84;

FIG. 106 is a plan view illustrating a sensing pattern of FIG. 84; and

FIG. 107 is a plan view illustrating the reflection pattern of FIG. 105and the sensing pattern of FIG. 106.

DETAILED DESCRIPTION

Hereinafter, the invention will be explained in detail with reference tothe accompanying drawings. This invention may, however, be embodied inmany different forms, and should not be construed as limited to theembodiments set forth herein. Rather, these embodiments are provided sothat this invention will be thorough and complete, and will fully conveythe scope of the invention to those skilled in the art. Like referencenumerals refer to like elements throughout.

It will be understood that when an element is referred to as being “on”another element, it can be directly on the other element or interveningelements may be therebetween. In contrast, when an element is referredto as being “directly on” another element, there are no interveningelements present.

It will be understood that, although the terms “first,” “second,”“third” etc. may be used herein to describe various elements,components, regions, layers and/or sections, these elements, components,regions, layers and/or sections should not be limited by these terms.These terms are only used to distinguish one element, component, region,layer or section from another element, component, region, layer orsection. Thus, “a first element,” “component,” “region,” “layer” or“section” discussed below could be termed a second element, component,region, layer or section without departing from the teachings herein.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting. As used herein, thesingular forms “a,” “an,” and “the” are intended to include the pluralforms, including “at least one,” unless the content clearly indicatesotherwise. “Or” means “and/or.” As used herein, the term “and/or”includes any and all combinations of one or more of the associatedlisted items. It will be further understood that the terms “comprises”and/or “comprising,” or “includes” and/or “including” when used in thisspecification, specify the presence of stated features, regions,integers, steps, operations, elements, and/or components, but do notpreclude the presence or addition of one or more other features,regions, integers, steps, operations, elements, components, and/orgroups thereof.

Furthermore, relative terms, such as “lower” or “bottom” and “upper” or“top,” may be used herein to describe one element's relationship toanother element as illustrated in the Figures. It will be understoodthat relative terms are intended to encompass different orientations ofthe device in addition to the orientation depicted in the Figures. In anexemplary embodiment, when the device in one of the figures is turnedover, elements described as being on the “lower” side of other elementswould then be oriented on “upper” sides of the other elements. Theexemplary term “lower,” can therefore, encompasses both an orientationof “lower” and “upper,” depending on the particular orientation of thefigure. Similarly, when the device in one of the figures is turned over,elements described as “below” or “beneath” other elements would then beoriented “above” the other elements. The exemplary terms “below” or“beneath” can, therefore, encompass both an orientation of above andbelow.

“About” or “approximately” as used herein is inclusive of the statedvalue and means within an acceptable range of deviation for theparticular value as determined by one of ordinary skill in the art,considering the measurement in question and the error associated withmeasurement of the particular quantity (i.e., the limitations of themeasurement system). For example, “about” can mean within one or morestandard deviations, or within ±30%, 20%, 10%, 5% of the stated value.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this invention belongs. It will befurther understood that terms, such as those defined in commonly useddictionaries, should be interpreted as having a meaning that isconsistent with their meaning in the context of the relevant art and theinvention, and will not be interpreted in an idealized or overly formalsense unless expressly so defined herein.

Exemplary embodiments are described herein with reference to crosssection illustrations that are schematic illustrations of idealizedembodiments. As such, variations from the shapes of the illustrations asa result, for example, of manufacturing techniques and/or tolerances,are to be expected. Thus, embodiments described herein should not beconstrued as limited to the particular shapes of regions as illustratedherein but are to include deviations in shapes that result, for example,from manufacturing. In an exemplary embodiment, a region illustrated ordescribed as flat may, typically, have rough and/or nonlinear features.Moreover, sharp angles that are illustrated may be rounded. Thus, theregions illustrated in the figures are schematic in nature and theirshapes are not intended to illustrate the precise shape of a region andare not intended to limit the scope of the claims.

FIG. 1 is a plan view illustrating an organic light emitting display(“OLED”) device according to an exemplary embodiment of the invention.FIG. 2 is a cross-sectional view taken along line I-I′ of FIG. 1.

Referring to FIGS. 1 and 2, an OLED device according to an exemplaryembodiment of the invention may include a light-emitting region II and areflection region III. Pixels 60, 70, and 80 may be positioned in thelight-emitting region II, and a transparent window may be positioned inthe reflection region III. In an exemplary embodiment, the pixel 60 maybe a pixel emitting a red color, the pixel 70 may be a pixel emitting agreen color, and the pixel 80 may be a pixel emitting a blue color, forexample.

A reflection member may be disposed in the light-emitting region II andthe reflection region III. The reflection member may include a firstreflection member disposed in the reflection region III and a secondreflection member disposed in the light-emitting region II and thereflection region III. The first reflection member may have differentreflectivity from the second reflection member. When the reflectionmember includes only the first reflection member, scattered reflectionmay be occurred at an edge of the first reflection member. However, anOLED device according to an exemplary embodiment of the inventionincludes the second reflection member disposed in the light-emittingregion II and the reflection region III. Thus, scattered reflectionoccurred at an edge of the first reflection member may be decreased.

The first reflection member according to an exemplary embodiment of theinvention may be a reflection pattern 370 including a material having apredetermined reflectivity. In addition, the second reflection memberaccording to an exemplary embodiment of the invention may be a sensingpattern 390 including a material having a predetermined reflectivity andconfigured to sense a touch position. The reflection pattern 370 mayoverlap the sensing pattern 390.

The sensing pattern 390 may function as a sensing electrode of a touchscreen panel of self capacitance type. In an exemplary embodiment, whenan electric conductor is contacted, capacitance of the sensing pattern390 around a touch position is changed, for example. Thus, a touch panelsensor (not shown) may decide a touch position based on a capacitancesensing signal corresponding to the change of capacitance. However, theinvention is not limited thereto, and the reflection pattern 370 mayfunction as a sensing electrode of a touch screen panel of selfcapacitance type. In addition, both the reflection pattern 370 and thesensing pattern 390 may function as a sensing electrode of a touchscreen panel of self capacitance type.

An OLED device 100 according to an exemplary embodiment of the inventionincludes a first substrate 110, a buffer layer 115, a first insulationinterlayer 150, a second insulation layer 190, a third insulation layer270, a light emitting structure, a pixel defining layer 310, areflection pattern 370, a sensing pattern 390 and a second substrate350. Here, the light emitting structure includes a semiconductor element250, a lower electrode 290, an emission layer 330 and an upper electrode340. The semiconductor element 250 includes an active pattern 130, agate electrode 170, a source electrode 210 and a drain electrode 230. Anopening 380 is defined in the reflection pattern 370.

The OLED device 100 may include a plurality of pixel regions. One pixelregion may include the light-emitting region II and the reflectionregion III. The reflection region III may substantially surround thelight-emitting region II. The semiconductor element 250, the lowerelectrode 290, the emission layer 330 and a portion of the upperelectrode 340 may be disposed in the light-emitting region II. Inaddition, the reflection pattern 370 may be disposed in the reflectionregion III, and the sensing pattern 390 may be disposed in thelight-emitting region II and the reflection region III.

A display image may be displayed in light-emitting region II. An imageof an object that is located in the front of the OLED device 100 may bereflected in the reflection region III.

The light emitting structure may be disposed on the first substrate 110.The first substrate 110 may include transparent materials. In anexemplary embodiment, the first substrate 110 may include quartz,synthetic quartz, calcium fluoride, fluoride-doping quartz, a sodalimeglass, a non-alkali glass etc., for example. In an alternative exemplaryembodiment, the first substrate 110 may include a flexible transparentresin substrate. Here, the flexible transparent resin substrate for thefirst substrate 110 may include a polyimide substrate. In an exemplaryembodiment, the polyimide substrate may include at least one of a firstpolyimide layer, a barrier film layer, a second polyimide layer, etc.,for example. When the polyimide substrate is thin and flexible, thepolyimide substrate may be disposed on a rigid glass substrate to helpsupport the formation of the light emitting structure. That is, inexemplary embodiments, the first substrate 110 may have a structure inwhich the first polyimide layer, the barrier film layer and the secondpolyimide layer are stacked on a glass substrate. Here, after aninsulation layer is provided on the second polyimide layer, the lightemitting structure (e.g., the semiconductor element 250, a capacitor,the lower electrode 290, the light emitting layer 330, the upperelectrode 340, etc.) may be disposed on the insulation layer.

After the light emitting structure is disposed on the insulation layer,the glass substrate may be removed. It may be difficult that the lightemitting structure is directly disposed on the polyimide substratebecause the polyimide substrate is thin and flexible. Accordingly, thelight emitting structure is disposed on a rigid glass substrate, andthen the polyimide substrate may serve as the first substrate 110 afterthe removal of the glass substrate. As the OLED device 100 includes thelight-emitting region hand the reflection region III, the firstsubstrate 110 may also include the light-emitting region II and thereflection region III.

A buffer layer 115 may be disposed on the first substrate 110. Thebuffer layer 115 may extend from the light-emitting region II into thereflection region III. The buffer layer 115 may prevent the diffusion(e.g., an out gassing) of metal atoms and/or impurities from the firstsubstrate 110. Additionally, the buffer layer 115 may control a rate ofa heat transfer in a crystallization process for forming the activepattern 130, thereby obtaining substantially uniform the active pattern130. Furthermore, the buffer layer 115 may improve a surface flatness ofthe first substrate 110 when a surface of the first substrate 110 isrelatively irregular. According to a type of the first substrate 110, atleast two buffer layers may be provided on the first substrate 110, orthe buffer layer may not be disposed.

The semiconductor element 250 may include the active pattern 130, thegate electrode 170, the source electrode 210, and the drain electrode230. In an exemplary embodiment, the active pattern 130 may be disposedon the first substrate 110, for example. In an exemplary embodiment, theactive pattern 130 may include at least one of an oxide semiconductor,an inorganic semiconductor (e.g., amorphous silicon, polysilicon, etc.),an organic semiconductor, etc., for example.

The first insulation layer 150 may be disposed on the active pattern130. The first insulation layer 150 may cover the active pattern 130 inthe light-emitting region II, and may extend in the first direction onthe first substrate 110. That is, the first insulation layer 150 may bedisposed on the entire first substrate 110. In an exemplary embodiment,the first insulation layer 150 may include at least one of a siliconcompound, a metal oxide, etc., for example.

The gate electrode 170 may be disposed on a portion of the firstinsulation layer 150 under which the active pattern 130 is disposed. Inan exemplary embodiment, the gate electrode 170 may include a metal, analloy, metal nitride, conductive metal oxide, transparent conductivematerials, etc., for example.

The second insulation layer 190 may be disposed on the gate electrode170. The second insulation layer 190 may cover the gate electrode 170 inthe light-emitting region II, and may extend in the first direction onthe first substrate 110. That is, the second insulation layer 190 may bedisposed on the entire first substrate 110. In an exemplary embodiment,the second insulation layer 190 may include a silicon compound, a metaloxide, etc., for example.

The source electrode 210 and the drain electrode 230 may be disposed onthe second insulation layer 190. The source electrode 210 may contact afirst side of the active layer 130 by removing a portion of the firstand second insulation layers 150 and 190. The drain electrode 230 maycontact a second side of the active layer 130 by removing a secondportion of the first and second insulation layers 150 and 190. In anexemplary embodiment, each of the source electrode 210 and the drainelectrode 230 may include a metal, an alloy, metal nitride, conductivemetal oxide, transparent conductive materials, etc., for example.

The third insulation layer 270 may be disposed on the source electrode210 and the drain electrode 230. The third insulation layer 270 maycover the source electrode 210 and the drain electrode 230 in thesub-pixel region II, and may extend in the first direction on the firstsubstrate 110. That is, the third insulation layer 270 may be disposedon the entire first substrate 110. In an exemplary embodiment, the thirdinsulation layer 270 may include a silicon compound, a metal oxide,etc., for example.

The lower electrode 290 may be disposed on the third insulation layer270. The lower electrode 290 may contact the drain electrode 230 byremoving a portion of the third insulation layer 270. In addition, thelower electrode 290 may be electrically connected to the semiconductorelement 250. In an exemplary embodiment, the lower electrode 290 mayinclude a metal, an alloy, metal nitride, conductive metal oxide,transparent conductive materials, etc., for example.

The pixel defining layer 310 may be disposed the on third insulationlayer 270 to expose a portion of the lower electrode 290. The pixeldefining layer 310 may include organic materials or inorganic materials.In this case, the light emitting layer 330 may be disposed on a portionthat the lower electrode 290 is exposed by the pixel defining layer 310.

The light emitting layer 330 may be disposed on the exposed lowerelectrode 290. The light emitting layer 330 may be provided using lightemitting materials generating different colors of light (e.g., a redcolor of light, a blue color of light, and a green color of light).

The upper electrode 340 may be disposed on the pixel defining layer 310and the light emitting layer 330. The upper electrode 340 may cover thepixel defining layer 310 and the light emitting layer 330 in thelight-emitting region II and the reflection region III, and may extendin the first direction on the first substrate 110. That is, the upperelectrode 340 may be electrically connected to the first through thirdpixels. In an exemplary embodiment, the upper electrode 340 may includea metal, an alloy, metal nitride, conductive metal oxide, a transparentconductive material, etc., for example. These may be used alone or in acombination thereof.

The sensing pattern 390 may include a material having a predeterminedreflectivity. In an exemplary embodiment, the sensing pattern 390 mayinclude gold (Au), silver (Ag), aluminum (Al), magnesium (Mg), platinum(Pt), Nickel (Ni), titanium (Ti), etc., for example. In an alternativeexemplary embodiment, the sensing pattern 390 may include an alloy,metal nitride, conductive metal oxide, etc., for example. In anexemplary embodiment, the sensing pattern 390 may include an alloyincluding aluminum, aluminum nitride (AlNx), an alloy including silver,tungsten nitride (WNx), an alloy including copper, chrome nitride(CrNx), an alloy including molybdenum, titanium nitride (TiNx), tantalumnitride (TaNx), SRO, zinc oxide (ZnOx), stannum oxide (SnOx), indiumoxide (InOx), gallium oxide (GaOx), etc., for example.

The second substrate 350 and the first substrate 110 may includesubstantially the same materials. In an exemplary embodiment, the secondsubstrate 350 may include quartz, synthetic quartz, calcium fluoride,fluoride-doping quartz, sodalime glass, non-alkali glass etc., forexample. In exemplary embodiments, the second substrate 350 may includea transparent inorganic material or flexible plastic. In an exemplaryembodiment, the second substrate 350 may include a flexible transparentresin substrate, for example. In this case, to increase flexibility ofthe OLED device 100, the second substrate 350 may include a stackedstructure where at least one organic layer and at least one inorganiclayer are alternately stacked.

A fourth insulation layer 385 is disposed on the sensing pattern 390.The fourth insulation layer 385 may include an adhesive material.

The reflection pattern 370 is disposed on the fourth insulation layer385. The reflection pattern 370 may be disposed in the reflection regionIII.

The reflection pattern 370 may include a material having a predeterminedreflectivity. In an exemplary embodiment, the reflection pattern 370 mayinclude gold (Au), silver (Ag), aluminum (Al), magnesium (Mg), platinum(Pt), Nickel (Ni), titanium (Ti), etc., for example. In an alternativeexemplary embodiment, the reflection pattern 370 may include an alloy,metal nitride, conductive metal oxide, etc., for example. In anexemplary embodiment, the reflection pattern 370 may include an alloyincluding aluminum, aluminum nitride (AlNx), an alloy including silver,tungsten nitride (WNx), an alloy including copper, chrome nitride(CrNx), an alloy including molybdenum, titanium nitride (TiNx), tantalumnitride (TaNx), SRO, zinc oxide (ZnOx), stannum oxide (SnOx), indiumoxide (InOx), gallium oxide (GaOx), etc., for example.

FIGS. 3 to 10 are cross-sectional views illustrating a method ofmanufacturing the OLED device 100 of FIG. 2.

Referring to FIG. 3, the buffer layer 115 is disposed on the firstsubstrate 110. Thereafter, the active pattern 130 and the firstinsulation layer 150 are disposed on the buffer layer 115.

In an exemplary embodiment, the first substrate 110 may include quartz,synthetic quartz, calcium fluoride, fluoride-doping quartz, a sodalimeglass, a non-alkali glass etc., for example.

A buffer layer 115 may be disposed on the first substrate 110. Thebuffer layer 115 may extend from the light-emitting region II into thereflection region III. The buffer layer 115 may prevent the diffusion(e.g., an out gassing) of metal atoms and/or impurities from the firstsubstrate 110. Additionally, the buffer layer 115 may control a rate ofa heat transfer in a crystallization process for forming the activepattern 130, thereby obtaining substantially uniform the active pattern130. Furthermore, the buffer layer 115 may improve a surface flatness ofthe first substrate 110 when a surface of the first substrate 110 isrelatively irregular. According to a type of the first substrate 110, atleast two buffer layers may be provided on the first substrate 110, orthe buffer layer may not be disposed.

In an exemplary embodiment, the active pattern 130 may include at leastone of an oxide semiconductor, an inorganic semiconductor (e.g.,amorphous silicon, polysilicon, etc.), an organic semiconductor, etc.,for example.

The first insulation layer 150 may be disposed on the active pattern130. The first insulation layer 150 may cover the active pattern 130 inthe light-emitting region II, and may extend in the first direction onthe first substrate 110. That is, the first insulation layer 150 may bedisposed on the entire first substrate 110. In an exemplary embodiment,the first insulation layer 150 may include at least one of a siliconcompound, a metal oxide, etc., for example.

Referring to FIG. 4, the gate electrode 170 and the second insulationlayer 190 are disposed on the first substrate 110 on which the firstinsulation layer 150 is disposed.

The gate electrode 170 may be disposed on a portion of the firstinsulation layer 150 under which the active pattern 130 is disposed. Inan exemplary embodiment, the gate electrode 170 may include a metal, analloy, metal nitride, conductive metal oxide, transparent conductivematerials, etc., for example.

The second insulation layer 190 may be disposed on the gate electrode170. The second insulation layer 190 may cover the gate electrode 170 inthe light-emitting region II, and may extend in the first direction onthe first substrate 110. That is, the second insulation layer 190 may bedisposed on the entire first substrate 110. In an exemplary embodiment,the second insulation layer 190 may include a silicon compound, a metaloxide, etc., for example.

Referring to FIG. 5, the source electrode 210 and the drain electrode230 are disposed on the first substrate 110 on which the secondinsulation layer 190 is disposed.

The source electrode 210 and the drain electrode 230 may be disposed onthe second insulation layer 190. The source electrode 210 may contact afirst side of the active layer 130 by removing a portion of the firstand second insulation layers 150 and 190. The drain electrode 230 maycontact a second side of the active layer 130 by removing a secondportion of the first and second insulation layers 150 and 190. In anexemplary embodiment, each of the source electrode 210 and the drainelectrode 230 may include a metal, an alloy, metal nitride, conductivemetal oxide, transparent conductive materials, etc., for example.

Referring to FIG. 6, the third insulation layer 270 and the lowerelectrode 290 are disposed on the first substrate 110 on which thesource electrode 210 and the drain electrode 230 are disposed.

The third insulation layer 270 may be disposed on the source electrode210 and the drain electrode 230. The third insulation layer 270 maycover the source electrode 210 and the drain electrode 230 in thesub-pixel region II, and may extend in the first direction on the firstsubstrate 110. That is, the third insulation layer 270 may be disposedon the entire first substrate 110. In an exemplary embodiment, the thirdinsulation layer 270 may include a silicon compound, a metal oxide,etc., for example.

The lower electrode 290 may be disposed on the third insulation layer270. The lower electrode 290 may contact the drain electrode 230 byremoving a portion of the third insulation layer 270. In addition, thelower electrode 290 may be electrically connected to the semiconductorelement 250. In an exemplary embodiment, the lower electrode 290 mayinclude at least one of a metal, an alloy, metal nitride, conductivemetal oxide, transparent conductive materials, etc., for example.

Referring to FIG. 7, the pixel defining layer 310, the light emittinglayer 330 and the upper electrode 340 are disposed on the firstsubstrate 110 on which the lower electrode 290 is disposed.

The pixel defining layer 310 may be disposed the on third insulationlayer 270 to expose a portion of the lower electrode 290. The pixeldefining layer 310 may include organic materials or inorganic materials.In this case, the light emitting layer 330 may be disposed on a portionthat the lower electrode 290 is exposed by the pixel defining layer 310.

The light emitting layer 330 may be disposed on the exposed lowerelectrode 290. The light emitting layer 330 may be provided using lightemitting materials generating different colors of light (e.g., a redcolor of light, a blue color of light, and a green color of light).

The upper electrode 340 may be disposed on the pixel defining layer 310and the light emitting layer 330. The upper electrode 340 may cover thepixel defining layer 310 and the light emitting layer 330 inlight-emitting region II and the reflection region III, and may extendin the first direction on the first substrate 110. That is, the upperelectrode 340 may be electrically connected to the first through thirdpixels. In an exemplary embodiment, the upper electrode 340 may includeat least one of a metal, an alloy, metal nitride, conductive metaloxide, a transparent conductive material, etc., for example. These maybe used alone or in a combination thereof.

Referring to FIG. 8, the sensing pattern 390 is disposed on the secondsubstrate 350.

The sensing pattern 390 may be disposed on a first surface of the secondsubstrate 350. The sensing pattern 390 may be disposed between the firstsubstrate 110 and the second substrate 350. The sensing pattern 390 maybe disposed in the light-emitting region II and the reflection regionIII.

The sensing pattern 390 may include a material having a predeterminedreflectivity. In an exemplary embodiment, the sensing pattern 390 mayinclude at least one of gold (Au), silver (Ag), aluminum (Al), magnesium(Mg), platinum (Pt), Nickel (Ni), titanium (Ti), etc., for example. Inan alternative exemplary embodiment, the sensing pattern 390 may includeat least one of an alloy, metal nitride, conductive metal oxide, etc.,for example. In an exemplary embodiment, the sensing pattern 390 mayinclude at least one of an alloy including aluminum, aluminum nitride(AlNx), an alloy including silver, tungsten nitride (WNx), an alloyincluding copper, chrome nitride (CrNx), an alloy including molybdenum,titanium nitride (TiNx), tantalum nitride (TaNx), SRO, zinc oxide(ZnOx), stannum oxide (SnOx), indium oxide (InOx), gallium oxide (GaOx),etc., for example.

The second substrate 350 and the first substrate 110 may includesubstantially the same materials. In an exemplary embodiment, the secondsubstrate 350 may include at least one of quartz, synthetic quartz,calcium fluoride, fluoride-doping quartz, sodalime glass, non-alkaliglass etc., for example.

Referring to FIG. 9, the fourth insulation layer 385 is disposed on thesecond substrate 350 on which the sensing pattern 390 is disposed.

The fourth insulation layer 385 may prevent from oxidation of thesensing pattern 390. The fourth insulation layer 385 may include anadhesive material. The fourth insulation layer 385 may prevent fromseparating of the reflection pattern 370 and the sensing pattern 390from the second substrate 350. The fourth insulation layer 385 mayinsulate between the reflection pattern 370 and the sensing pattern 390.

Referring to FIG. 10, the reflection pattern 370 is disposed on thefourth insulation layer 385.

The reflection pattern 370 may be disposed in the reflection region III.

The reflection pattern 370 may include a material having a predeterminedreflectivity. In an exemplary embodiment, the reflection pattern 370 mayinclude at least one of gold (Au), silver (Ag), aluminum (Al), magnesium(Mg), platinum (Pt), Nickel (Ni), titanium (Ti), etc., for example. Inan alternative exemplary embodiment, the reflection pattern 370 mayinclude at least one of an alloy, metal nitride, conductive metal oxide,etc., for example. In an exemplary embodiment, the reflection pattern370 may include at least one of an alloy including aluminum, aluminumnitride (AlNx), an alloy including silver, tungsten nitride (WNx), analloy including copper, chrome nitride (CrNx), an alloy includingmolybdenum, titanium nitride (TiNx), tantalum nitride (TaNx), SRO, zincoxide (ZnOx), stannum oxide (SnOx), indium oxide (InOx), gallium oxide(GaOx), etc., for example.

FIG. 11 is a plan view illustrating a reflection pattern of FIG. 2. FIG.12 is a plan view illustrating a sensing pattern of FIG. 2. FIG. 13 is aplan view illustrating the reflection pattern of FIG. 11 and the sensingpattern of FIG. 12.

Referring to FIG. 2 and FIGS. 11 to 13, the reflection pattern 370 andthe sensing pattern 390 are illustrated.

The reflection pattern 370 is disposed only in the reflection regionIII. Thus, the reflection pattern 370 is not disposed in a region thatthe Pixels 60, 70, and 80 are disposed. The reflection pattern 370 isprovided as one pattern.

The sensing pattern 390 is disposed in the light-emitting region II andthe reflection region III. The sensing pattern 390 may be electricallyconnected to a sensing driver (not shown) through a connection line 395.The connection line 395 may include the same material as that of thesensing pattern 390. The connection line 395 may disposed on the samelayer as the sensing pattern 390. However, the invention is not limitedthereto, and the connection line 395 may include different material fromthe sensing pattern 390.

The sensing pattern 390 may function as a sensing electrode of a touchscreen panel of self capacitance type. In an exemplary embodiment, whenan electric conductor is contacted, capacitance of the sensing pattern390 around a touch position is changed, for example. Thus, a touch panelsensor (not shown) may decide a touch position based on a capacitancesensing signal corresponding to the change of capacitance.

The sensing pattern 390 may have a size corresponding to a predeterminednumber of unit pixels Px. The sensing pattern 390 may have anappropriate size according to a size of a display device.

FIG. 14 is a plan view illustrating a reflection pattern of FIG. 2. FIG.15 is a plan view illustrating a sensing pattern of FIG. 2. FIG. 16 is aplan view illustrating the reflection pattern of FIG. 14 and the sensingpattern of FIG. 15.

Referring to FIG. 2 and FIGS. 14 to 16, the reflection pattern 370 andthe sensing pattern 390 are illustrated.

The reflection pattern 370 is disposed only in the reflection regionIII. Thus, the reflection pattern 370 is not disposed in a region thatthe Pixels 60, 70, and 80 are disposed. The reflection pattern 370 mayfunction as a sensing electrode of a touch screen panel of selfcapacitance type. The reflection pattern 370 may have a sizecorresponding to a predetermined number of unit pixels Px. Thereflection pattern 370 may have an appropriate size according to a sizeof a display device.

The reflection pattern 370 may be electrically connected to a sensingdriver (not shown) through a first connection line 375. The firstconnection line 375 may include the same material as that of thereflection pattern 370. The first connection line 375 may disposed onthe same layer as the reflection pattern 370. However, the invention isnot limited thereto, and the first connection line 375 may includedifferent material from the reflection pattern 370.

The sensing pattern 390 is disposed in the light-emitting region II andthe reflection region III. The sensing pattern 390 may be electricallyconnected to a sensing driver (not shown) through a second connectionline 395. The second connection line 395 may include the same materialas that of the sensing pattern 390. The second connection line 395 maydisposed on the same layer as the sensing pattern 390. However, theinvention is not limited thereto, and the second connection line 395 mayinclude different material from the sensing pattern 390.

The sensing pattern 390 may function as a sensing electrode of a touchscreen panel of self capacitance type. In an exemplary embodiment, whenan electric conductor is contacted, capacitance of the sensing pattern390 around a touch position is changed, for example. Thus, a touch panelsensor (not shown) may decide a touch position based on a capacitancesensing signal corresponding to the change of capacitance.

The sensing pattern 390 may have a size corresponding to a predeterminednumber of unit pixels Px. The sensing pattern 390 may have anappropriate size according to a size of a display device.

In the illustrated exemplary embodiment, a size of the reflectionpattern 370 may be bigger than a size of the sensing pattern 390. In anexemplary embodiment, the reflection pattern 370 may have a sizecorresponding to four reflection patterns 370, for example. However, theinvention is not limited thereto, and the reflection pattern 370 mayhave a various size.

Since the reflection pattern 370 is provided as relatively big area, thereflection pattern 370 may detect touch position of a wide range. Thus,reflection pattern 370 senses a touch position of a wide range, andafter the reflection pattern 370 senses the touch position, the sensingpattern 390 senses an accurate touch position. Accordingly, high speeddriving of a touch screen panel may be performed.

FIG. 17 is a plan view illustrating a reflection pattern of FIG. 2. FIG.18 is a plan view illustrating a sensing pattern of FIG. 2. FIG. 19 is aplan view illustrating the reflection pattern of FIG. 17 and the sensingpattern of FIG. 18.

Referring to FIG. 2 and FIGS. 17 to 19, the reflection pattern 370 andthe sensing pattern 390 are illustrated.

The reflection pattern 370 is disposed only in the reflection regionIII. Thus, the reflection pattern 370 is not disposed in a region thatthe Pixels 60, 70, and 80 are disposed. The reflection pattern 370 isprovided as one pattern.

The sensing pattern 390 is disposed in the light-emitting region II andthe reflection region III. The sensing pattern 390 may be electricallyconnected to a sensing driver (not shown) through a connection line 395.The connection line 395 may include the same material as that of thesensing pattern 390. The connection line 395 may disposed on the samelayer as the sensing pattern 390. However, the invention is not limitedthereto, and the connection line 395 may include different material fromthe sensing pattern 390.

The sensing pattern 390 may function as a sensing electrode of a touchscreen panel of self capacitance type. In an exemplary embodiment, whenan electric conductor is contacted, capacitance of the sensing pattern390 around a touch position is changed, for example. Thus, a touch panelsensor (not shown) may decide a touch position based on a capacitancesensing signal corresponding to the change of capacitance.

The sensing pattern 390 may have a size corresponding to a predeterminednumber of unit pixels Px. The sensing pattern 390 may have anappropriate size according to a size of a display device.

In the illustrated exemplary embodiment, the sensing patterns 390classified as a plurality of sensing groups comprising a predeterminednumber of sensing patterns. In an exemplary embodiment, sensing patternsof A group are electrically connected to a first group driver 510, andsensing patterns of B group are electrically connected to a second groupdriver 520, for example. The first group driver 510 and the second groupdriver 520 are electrically connected to a sensing driver 600.

When a touch signal is applied to the sensing patterns 390, a sensinggroup to which the touch signal is applied is detected, and an accuratetouch position in the sensing group to which the touch signal is appliedis detected. Accordingly, high speed driving of a touch screen panel maybe performed.

FIG. 20 is a plan view illustrating a reflection pattern of FIG. 2. FIG.21 is a plan view illustrating a sensing pattern of FIG. 2. FIG. 22 is aplan view illustrating the reflection pattern of FIG. 20 and the sensingpattern of FIG. 21.

Referring to FIG. 2 and FIGS. 20 to 22, the reflection pattern 370 andthe sensing pattern 390 are illustrated.

The reflection pattern 370 is disposed only in the reflection regionIII. Thus, the reflection pattern 370 is not disposed in a region thatthe Pixels 60, 70, and 80 are disposed. The reflection pattern 370 maybe electrically connected to a sensing driver (not shown) through afirst connection line 375. The first connection line 375 may include thesame material as that of the reflection pattern 370. The firstconnection line 375 may disposed on the same layer as the reflectionpattern 370. However, the invention is not limited thereto, and thefirst connection line 375 may include different material from thereflection pattern 370.

The sensing pattern 390 is disposed in the light-emitting region II andthe reflection region III. The sensing pattern 390 may be electricallyconnected to a sensing driver (not shown) through a second connectionline 395. The second connection line 395 may include the same materialas that of the sensing pattern 390. The second connection line 395 maydisposed on the same layer as the sensing pattern 390. However, theinvention is not limited thereto, and the second connection line 395 mayinclude different material from the sensing pattern 390.

The sensing pattern 390 may function as a sensing electrode of a touchscreen panel of self capacitance type. In an exemplary embodiment, whenan electric conductor is contacted, capacitance of the sensing pattern390 around a touch position is changed, for example. Thus, a touch panelsensor (not shown) may decide a touch position based on a capacitancesensing signal corresponding to the change of capacitance.

The sensing pattern 390 may have a size corresponding to a predeterminednumber of unit pixels Px. The sensing pattern 390 may have anappropriate size according to a size of a display device.

In the illustrated exemplary embodiment, the sensing patterns 390classified as a plurality of sensing groups comprising a predeterminednumber of sensing patterns. In an exemplary embodiment, sensing patternsof A group are electrically connected to a first group driver 510, andsensing patterns of B group are electrically connected to a second groupdriver 520, for example. The first group driver 510 and the second groupdriver 520 are electrically connected to a sensing driver 600.

When a touch signal is applied to the sensing patterns 390, a sensinggroup to which the touch signal is applied is detected, and an accuratetouch position in the sensing group to which the touch signal is appliedis detected. Accordingly, high speed driving of a touch screen panel maybe performed.

When a touch signal is applied to the sensing pattern 390, potentialdifference between the sensing pattern 390 and the reflection pattern370 may be occurred. Thus, capacitance between the sensing pattern 390and the reflection pattern 370 is occurred, so that touch sensitivitymay be declined due to the capacitance between the sensing pattern 390and the reflection pattern 370.

However, in the illustrated exemplary embodiment, when a touch signal isapplied to a sensing pattern 390, a signal having the same signal as thetouch signal is applied to the reflection pattern 370. Thus, potentialdifference between the sensing pattern 390 and the reflection pattern370 may be not occurred. Thus, capacitance between the sensing pattern390 and the reflection pattern 370 is not occurred, so that decline oftouch sensitivity may be prevented.

FIG. 23 is a plan view illustrating a reflection pattern of FIG. 2. FIG.24 is a plan view illustrating a sensing pattern of FIG. 2. FIG. 25 is aplan view illustrating the reflection pattern of FIG. 23 and the sensingpattern of FIG. 24.

Referring to FIG. 2 and FIGS. 23 to 25, the reflection pattern 370 andthe sensing pattern 390 are illustrated.

The reflection pattern 370 is disposed only in the reflection regionIII. Thus, the reflection pattern 370 is not disposed in a region thatthe Pixels 60, 70, and 80 are disposed. The reflection pattern 370 maybe electrically connected to a sensing driver (not shown) through afirst connection line 375. The first connection line 375 may include thesame material as that of the reflection pattern 370. The firstconnection line 375 may disposed on the same layer as the reflectionpattern 370. However, the invention is not limited thereto, and thefirst connection line 375 may include different material from thereflection pattern 370.

The sensing pattern 390 is disposed in the light-emitting region II andthe reflection region III. The sensing pattern 390 may be electricallyconnected to a sensing driver (not shown) through a second connectionline 395. The second connection line 395 may include the same materialas that of the sensing pattern 390. The second connection line 395 maydisposed on the same layer as the sensing pattern 390. However, theinvention is not limited thereto, and the second connection line 395 mayinclude different material from the sensing pattern 390.

The sensing pattern 390 may function as a sensing electrode of a touchscreen panel of self capacitance type. In an exemplary embodiment, whenan electric conductor is contacted, capacitance of the sensing pattern390 around a touch position is changed. Thus, a touch panel sensor (notshown) may decide a touch position based on a capacitance sensing signalcorresponding to the change of capacitance.

The sensing pattern 390 may have a size corresponding to a predeterminednumber of unit pixels Px. The sensing pattern 390 may have anappropriate size according to a size of a display device.

In the illustrated exemplary embodiment, the sensing patterns 390classified as a plurality of sensing groups comprising a predeterminednumber of sensing patterns. In an exemplary embodiment, sensing patternsof A group are electrically connected to a first group driver 510, andsensing patterns of B group are electrically connected to a second groupdriver 520, for example. The first group driver 510 and the second groupdriver 520 are electrically connected to a sensing driver 600.

When a touch signal is applied to the sensing patterns 390, a sensinggroup to which the touch signal is applied is detected, and an accuratetouch position in the sensing group to which the touch signal is appliedis detected. Accordingly, high speed driving of a touch screen panel maybe performed.

In the illustrated exemplary embodiment, the reflection pattern 370 isprovided as a size corresponding to one group of the sensing patterns390. In an exemplary embodiment, the reflection pattern 370 may have asize corresponding to eight reflection patterns 370, for example.However, the invention is not limited thereto, and the reflectionpattern 370 may have a various size.

When a touch signal is applied to the sensing pattern 390, potentialdifference between the sensing pattern 390 and the reflection pattern370 may be occurred. Thus, capacitance between the sensing pattern 390and the reflection pattern 370 is occurred, so that touch sensitivitymay be declined due to the capacitance between the sensing pattern 390and the reflection pattern 370.

However, in the illustrated exemplary embodiment, when a touch signal isapplied to a sensing pattern 390, a signal having the same signal as thetouch signal is applied to the reflection pattern 370. Thus, potentialdifference between the sensing pattern 390 and the reflection pattern370 may be not occurred. Thus, capacitance between the sensing pattern390 and the reflection pattern 370 is not occurred, so that decline oftouch sensitivity may be prevented.

FIG. 26 is a plan view illustrating an OLED device according to anexemplary embodiment of the invention. FIG. 27 is a cross-sectional viewtaken along line IV-IV′ of FIG. 26.

The OLED device according to the illustrated exemplary embodiment issubstantially same as the OLED device of FIGS. 1 and 2 except for aconductive adhesive member 1400, and thus similar reference numerals areused for same elements and repetitive explanation will be omitted.

Referring to FIGS. 26 and 27, a reflection pattern 1370 disposed on asecond substrate 1350 is electrically connected to a conductive adhesivemember 1400. The conductive adhesive member 1400 may be electricallyconnected to pads (not shown) disposed on a first substrate 1110.

The conductive adhesive member 1400 may include a conductive material.The reflection pattern 1370 may be electrically connected to pads (notshown) disposed on a first substrate 1110 through the conductiveadhesive member 1400. Thus, additional flexible printed circuit board(“FPCB”) is not required.

The sensing pattern 1390 may function as a sensing electrode of a touchscreen panel of self capacitance type. In an exemplary embodiment, whenan electric conductor is contacted, capacitance of the sensing pattern1390 around a touch position is changed, for example. Thus, a touchpanel sensor (not shown) may decide a touch position based on acapacitance sensing signal corresponding to the change of capacitance.However, the invention is not limited thereto, and the reflectionpattern 1370 may function as a sensing electrode of a touch screen panelof self capacitance type. In addition, both the reflection pattern 1370and the sensing pattern 1390 may function as a sensing electrode of atouch screen panel of self capacitance type.

FIGS. 28 to 35 are cross-sectional views illustrating a method ofmanufacturing the OLED device of FIG. 27.

Referring to FIG. 28, the buffer layer 1115 is disposed on the firstsubstrate 1110. Thereafter, the active pattern 1130 and the firstinsulation layer 1150 are disposed on the buffer layer 1115.

In an exemplary embodiment, the first substrate 1110 may include atleast one of quartz, synthetic quartz, calcium fluoride, fluoride-dopingquartz, a sodalime glass, a non-alkali glass etc., for example.

A buffer layer 1115 may be disposed on the first substrate 1110. Thebuffer layer 1115 may extend from the light-emitting region II into thereflection region III. The buffer layer 1115 may prevent the diffusion(e.g., an out gassing) of metal atoms and/or impurities from the firstsubstrate 1110. Additionally, the buffer layer 1115 may control a rateof a heat transfer in a crystallization process for forming the activepattern 1130, thereby obtaining substantially uniform the active pattern1130. Furthermore, the buffer layer 1115 may improve a surface flatnessof the first substrate 1110 when a surface of the first substrate 1110is relatively irregular. According to a type of the first substrate1110, at least two buffer layers may be provided on the first substrate1110, or the buffer layer may not be disposed.

In an exemplary embodiment, the active pattern 1130 may include at leastone of an oxide semiconductor, an inorganic semiconductor (e.g.,amorphous silicon, polysilicon, etc.), an organic semiconductor, etc.,for example.

The first insulation layer 1150 may be disposed on the active pattern1130. The first insulation layer 1150 may cover the active pattern 1130in the light-emitting region II, and may extend in the first directionon the first substrate 1110. That is, the first insulation layer 1150may be disposed on the entire first substrate 1110. In an exemplaryembodiment, the first insulation layer 1150 may include at least one ofa silicon compound, a metal oxide, etc., for example.

Referring to FIG. 29, the gate electrode 1170 and the second insulationlayer 1190 are disposed on the first substrate 1110 on which the firstinsulation layer 1150 is disposed.

The gate electrode 1170 may be disposed on a portion of the firstinsulation layer 1150 under which the active pattern 1130 is disposed.In an exemplary embodiment, the gate electrode 1170 may include at leastone of a metal, an alloy, metal nitride, conductive metal oxide,transparent conductive materials, etc., for example.

The second insulation layer 1190 may be disposed on the gate electrode1170. The second insulation layer 1190 may cover the gate electrode 1170in the light-emitting region II, and may extend in the first directionon the first substrate 1110. That is, the second insulation layer 1190may be disposed on the entire first substrate 1110. In an exemplaryembodiment, the second insulation layer 1190 may include at least one ofa silicon compound, a metal oxide, etc., for example.

Referring to FIG. 30, the source electrode 1210 and the drain electrode1230 are disposed on the first substrate 1110 on which the secondinsulation layer 1190 is disposed.

The source electrode 1210 and the drain electrode 1230 may be disposedon the second insulation layer 1190. The source electrode 1210 maycontact a first side of the active layer 1130 by removing a portion ofthe first and second insulation layers 1150 and 1190. The drainelectrode 1230 may contact a second side of the active layer 1130 byremoving a second portion of the first and second insulation layers 1150and 1190. In an exemplary embodiment, each of the source electrode 1210and the drain electrode 1230 may include at least one of a metal, analloy, metal nitride, conductive metal oxide, transparent conductivematerials, etc., for example.

Referring to FIG. 31, the third insulation layer 1270 and the lowerelectrode 1290 are disposed on the first substrate 1110 on which thesource electrode 1210 and the drain electrode 1230 are disposed.

The third insulation layer 1270 may be disposed on the source electrode1210 and the drain electrode 1230. The third insulation layer 1270 maycover the source electrode 1210 and the drain electrode 1230 in thesub-pixel region II, and may extend in the first direction on the firstsubstrate 1110. That is, the third insulation layer 1270 may be disposedon the entire first substrate 1110. In an exemplary embodiment, thethird insulation layer 1270 may include at least one of a siliconcompound, a metal oxide, etc., for example.

The lower electrode 1290 may be disposed on the third insulation layer1270. The lower electrode 1290 may contact the drain electrode 1230 byremoving a portion of the third insulation layer 1270. In addition, thelower electrode 1290 may be electrically connected to the semiconductorelement 1250. In an exemplary embodiment, the lower electrode 1290 mayinclude at least one of a metal, an alloy, metal nitride, conductivemetal oxide, transparent conductive materials, etc., for example.

Referring to FIG. 32, the pixel defining layer 1310, the light emittinglayer 1330 and the upper electrode 1340 are disposed on the firstsubstrate 1110 on which the lower electrode 1290 is disposed.

The pixel defining layer 1310 may be disposed the on third insulationlayer 1270 to expose a portion of the lower electrode 1290. The pixeldefining layer 1310 may include organic materials or inorganicmaterials. In this case, the light emitting layer 1330 may be disposedon a portion that the lower electrode 1290 is exposed by the pixeldefining layer 1310.

The light emitting layer 1330 may be disposed on the exposed lowerelectrode 1290. The light emitting layer 1330 may be provided usinglight emitting materials generating different colors of light (e.g., ared color of light, a blue color of light, and a green color of light).

The upper electrode 1340 may be disposed on the pixel defining layer1310 and the light emitting layer 1330. The upper electrode 1340 maycover the pixel defining layer 1310 and the light emitting layer 1330 inlight-emitting region II and the reflection region III, and may extendin the first direction on the first substrate 1110. That is, the upperelectrode 1340 may be electrically connected to the first through thirdpixels. In an exemplary embodiment, the upper electrode 1340 may includeat least one of a metal, an alloy, metal nitride, conductive metaloxide, a transparent conductive material, etc., for example. These maybe used alone or in a combination thereof.

Referring to FIG. 33, the sensing pattern 1390 is disposed on the secondsubstrate 1350.

The sensing pattern 1390 may be disposed on a first surface of thesecond substrate 1350. The sensing pattern 1390 may be disposed betweenthe first substrate 1110 and the second substrate 1350. The sensingpattern 1390 may be disposed in the light-emitting region II and thereflection region III.

The sensing pattern 1390 may include a material having a predeterminedreflectivity. In an exemplary embodiment, the sensing pattern 1390 mayinclude at least one of gold (Au), silver (Ag), aluminum (Al), magnesium(Mg), platinum (Pt), Nickel (Ni), titanium (Ti), etc., for example. Inan alternative exemplary embodiment, the sensing pattern 1390 mayinclude at least one of an alloy, metal nitride, conductive metal oxide,etc., for example. In an exemplary embodiment, the sensing pattern 1390may include at least one of an alloy including aluminum, aluminumnitride (AlNx), an alloy including silver, tungsten nitride (WNx), analloy including copper, chrome nitride (CrNx), an alloy includingmolybdenum, titanium nitride (TiNx), tantalum nitride (TaNx), SRO, zincoxide (ZnOx), stannum oxide (SnOx), indium oxide (InOx), gallium oxide(GaOx), etc., for example.

The second substrate 1350 and the first substrate 1110 may includesubstantially the same materials. In an exemplary embodiment, the secondsubstrate 1350 may include at least one of quartz, synthetic quartz,calcium fluoride, fluoride-doping quartz, sodalime glass, non-alkaliglass etc., for example.

Referring to FIG. 34, the fourth insulation layer 1385 is disposed onthe second substrate 1350 on which the sensing pattern 1390 is disposed.

The fourth insulation layer 1385 may prevent from oxidation of thesensing pattern 1390. The fourth insulation layer 1385 may include anadhesive material. The fourth insulation layer 1385 may prevent fromseparating of the reflection pattern 1370 and the sensing pattern 1390from the second substrate 1350. The fourth insulation layer 1385 mayinsulate between the reflection pattern 1370 and the sensing pattern1390.

Referring to FIG. 35, the reflection pattern 1370 is disposed on thefourth insulation layer 1385.

The reflection pattern 1370 may be disposed in the reflection regionIII.

The reflection pattern 1370 may include a material having apredetermined reflectivity. In an exemplary embodiment, the reflectionpattern 1370 may include at least one of gold (Au), silver (Ag),aluminum (Al), magnesium (Mg), platinum (Pt), Nickel (Ni), titanium(Ti), etc., for example. In an alternative exemplary embodiment, thereflection pattern 1370 may include at least one of an alloy, metalnitride, conductive metal oxide, etc. In an exemplary embodiment, thereflection pattern 1370 may include at least one of an alloy includingaluminum, aluminum nitride (AlNx), an alloy including silver, tungstennitride (WNx), an alloy including copper, chrome nitride (CrNx), analloy including molybdenum, titanium nitride (TiNx), tantalum nitride(TaNx), SRO, zinc oxide (ZnOx), stannum oxide (SnOx), indium oxide(InOx), gallium oxide (GaOx), etc., for example.

Referring to FIG. 27, the reflection pattern 1370 is connected to thefirst substrate 1110 using the conductive adhesive member 1400.

The conductive adhesive member 1400 may include a conductive material.The reflection pattern 1370 may be electrically connected to pads (notshown) disposed on a first substrate 1110 through the conductiveadhesive member 1400. Thus, additional FPCB is not required.

FIG. 36 is a plan view illustrating a reflection pattern of FIG. 27.FIG. 37 is a plan view illustrating a sensing pattern of FIG. 27. FIG.38 is a plan view illustrating the reflection pattern of FIG. 36 and thesensing pattern of FIG. 37.

Referring to FIG. 27 and FIGS. 36 to 38, the reflection pattern 1370 andthe sensing pattern 1390 are illustrated.

The reflection pattern 1370 is disposed only in the reflection regionIII. Thus, the reflection pattern 1370 is not disposed in a region thatthe Pixels 60, 70, and 80 are disposed. The reflection pattern 1370 mayfunction as a sensing electrode of a touch screen panel of selfcapacitance type. The reflection pattern 1370 may have a sizecorresponding to a predetermined number of unit pixels Px. Thereflection pattern 1370 may have an appropriate size according to a sizeof a display device.

The reflection pattern 1370 may be electrically connected to a sensingdriver (not shown) through a first connection line 1375. The firstconnection line 1375 may include the same material as that of thereflection pattern 1370. The first connection line 1375 may disposed onthe same layer as the reflection pattern 1370. However, the invention isnot limited thereto, and the first connection line 1375 may includedifferent material from the reflection pattern 1370.

The reflection pattern 1370 disposed on a second substrate 1350 iselectrically connected to a conductive adhesive member 1400. Theconductive adhesive member 1400 may be electrically connected to pads(not shown) disposed on a first substrate 1110.

The sensing pattern 1390 is disposed in the light-emitting region II andthe reflection region III. The sensing pattern 390 may be electricallyconnected to a sensing driver (not shown) through a second connectionline 1395. The second connection line 1395 may include the same materialas that of the sensing pattern 1390. The second connection line 1395 maydisposed on the same layer as the sensing pattern 1390. However, theinvention is not limited thereto, and the second connection line 1395may include different material from the sensing pattern 1390.

The sensing pattern 1390 may function as a sensing electrode of a touchscreen panel of self capacitance type. In an exemplary embodiment, whenan electric conductor is contacted, capacitance of the sensing pattern1390 around a touch position is changed, for example. Thus, a touchpanel sensor (not shown) may decide a touch position based on acapacitance sensing signal corresponding to the change of capacitance.

The sensing pattern 1390 may have a size corresponding to apredetermined number of unit pixels Px. The sensing pattern 1390 mayhave an appropriate size according to a size of a display device.

In the illustrated exemplary embodiment, a size of the reflectionpattern 1370 may be bigger than a size of the sensing pattern 1390. Inan exemplary embodiment, the reflection pattern 1370 may have a sizecorresponding to four reflection patterns 1370, for example. However,the invention is not limited thereto, and the reflection pattern 1370may have a various size.

Since the reflection pattern 370 is provided as relatively big area, thereflection pattern 370 may detect touch position of a wide range. Thus,reflection pattern 370 senses a touch position of a wide range, andafter the reflection pattern 370 senses the touch position, the sensingpattern 390 senses an accurate touch position. Accordingly, high speeddriving of a touch screen panel may be performed.

FIG. 39 is a plan view illustrating a reflection pattern of FIG. 27.FIG. 40 is a plan view illustrating a sensing pattern of FIG. 27. FIG.41 is a plan view illustrating the reflection pattern of FIG. 39 and thesensing pattern of FIG. 40.

Referring to FIG. 27 and FIGS. 39 to 41, the reflection pattern 1370 andthe sensing pattern 1390 are illustrated.

The reflection pattern 1370 is disposed only in the reflection regionIII. Thus, the reflection pattern 1370 is not disposed in a region thatthe Pixels 60, 70, and 80 are disposed. The reflection pattern 1370 maybe electrically connected to a sensing driver (not shown) through afirst connection line 1375. The first connection line 1375 may includethe same material as that of the reflection pattern 1370. The firstconnection line 1375 may disposed on the same layer as the reflectionpattern 1370. However, the invention is not limited thereto, and thefirst connection line 1375 may include different material from thereflection pattern 1370.

The reflection pattern 1370 disposed on a second substrate 1350 iselectrically connected to a conductive adhesive member 1400. Theconductive adhesive member 1400 may be electrically connected to pads(not shown) disposed on a first substrate 1110.

The sensing pattern 1390 is disposed in the light-emitting region II andthe reflection region III. The sensing pattern 1390 may be electricallyconnected to a sensing driver (not shown) through a second connectionline 1395. The second connection line 1395 may include the same materialas that of the sensing pattern 1390. The second connection line 1395 maydisposed on the same layer as the sensing pattern 1390. However, theinvention is not limited thereto, and the second connection line 1395may include different material from the sensing pattern 1390.

The sensing pattern 1390 may function as a sensing electrode of a touchscreen panel of self capacitance type. In an exemplary embodiment, whenan electric conductor is contacted, capacitance of the sensing pattern1390 around a touch position is changed, for example. Thus, a touchpanel sensor (not shown) may decide a touch position based on acapacitance sensing signal corresponding to the change of capacitance.

The sensing pattern 1390 may have a size corresponding to apredetermined number of unit pixels Px. The sensing pattern 1390 mayhave an appropriate size according to a size of a display device.

In the illustrated exemplary embodiment, the sensing patterns 1390classified as a plurality of sensing groups comprising a predeterminednumber of sensing patterns. In an exemplary embodiment, sensing patternsof A group are electrically connected to a first group driver 1510, andsensing patterns of B group are electrically connected to a second groupdriver 1520, for example. The first group driver 1510 and the secondgroup driver 1520 are electrically connected to a sensing driver 1600.

When a touch signal is applied to the sensing patterns 1390, a sensinggroup to which the touch signal is applied is detected, and an accuratetouch position in the sensing group to which the touch signal is appliedis detected. Accordingly, high speed driving of a touch screen panel maybe performed.

When a touch signal is applied to the sensing pattern 1390, potentialdifference between the sensing pattern 1390 and the reflection pattern1370 may be occurred. Thus, capacitance between the sensing pattern 1390and the reflection pattern 1370 is occurred, so that touch sensitivitymay be declined due to the capacitance between the sensing pattern 1390and the reflection pattern 1370.

However, in the illustrated exemplary embodiment, when a touch signal isapplied to a sensing pattern 1390, a signal having the same signal asthe touch signal is applied to the reflection pattern 1370. Thus,potential difference between the sensing pattern 1390 and the reflectionpattern 1370 may be not occurred. Thus, capacitance between the sensingpattern 1390 and the reflection pattern 1370 is not occurred, so thatdecline of touch sensitivity may be prevented.

FIG. 42 is a plan view illustrating a reflection pattern of FIG. 27.FIG. 43 is a plan view illustrating a sensing pattern of FIG. 27. FIG.44 is a plan view illustrating the reflection pattern of FIG. 42 and thesensing pattern of FIG. 43.

Referring to FIG. 27 and FIGS. 42 to 44, the reflection pattern 1370 andthe sensing pattern 1390 are illustrated.

The reflection pattern 1370 is disposed only in the reflection regionIII. Thus, the reflection pattern 1370 is not disposed in a region thatthe Pixels 60, 70, and 80 are disposed. The reflection pattern 1370 maybe electrically connected to a sensing driver (not shown) through afirst connection line 1375. The first connection line 1375 may includethe same material as that of the reflection pattern 1370. The firstconnection line 1375 may disposed on the same layer as the reflectionpattern 1370. However, the invention is not limited thereto, and thefirst connection line 1375 may include different material from thereflection pattern 1370.

The reflection pattern 1370 disposed on a second substrate 1350 iselectrically connected to a conductive adhesive member 1400. Theconductive adhesive member 1400 may be electrically connected to pads(not shown) disposed on a first substrate 1110.

The sensing pattern 1390 is disposed in the light-emitting region II andthe reflection region III. The sensing pattern 1390 may be electricallyconnected to a sensing driver (not shown) through a second connectionline 1395. The second connection line 1395 may include the same materialas that of the sensing pattern 1390. The second connection line 1395 maydisposed on the same layer as the sensing pattern 1390. However, theinvention is not limited thereto, and the second connection line 1395may include different material from the sensing pattern 1390.

The sensing pattern 1390 may function as a sensing electrode of a touchscreen panel of self capacitance type. In an exemplary embodiment, whenan electric conductor is contacted, capacitance of the sensing pattern1390 around a touch position is changed, for example. Thus, a touchpanel sensor (not shown) may decide a touch position based on acapacitance sensing signal corresponding to the change of capacitance.

The sensing pattern 1390 may have a size corresponding to apredetermined number of unit pixels Px. The sensing pattern 1390 mayhave an appropriate size according to a size of a display device.

In the illustrated exemplary embodiment, the sensing patterns 1390classified as a plurality of sensing groups comprising a predeterminednumber of sensing patterns. In an exemplary embodiment, sensing patternsof A group are electrically connected to a first group driver 1510, andsensing patterns of B group are electrically connected to a second groupdriver 1520, for example. The first group driver 1510 and the secondgroup driver 1520 are electrically connected to a sensing driver 1600.

When a touch signal is applied to the sensing patterns 1390, a sensinggroup to which the touch signal is applied is detected, and an accuratetouch position in the sensing group to which the touch signal is appliedis detected. Accordingly, high speed driving of a touch screen panel maybe performed.

In the exemplary embodiment, the reflection pattern 1370 is provided asa size corresponding to one group of the sensing patterns 1390. In anexemplary embodiment, the reflection pattern 1370 may have a sizecorresponding to eight reflection patterns 1370, for example. However,the invention is not limited thereto, and the reflection pattern 1370may have a various size.

When a touch signal is applied to the sensing pattern 1390, potentialdifference between the sensing pattern 1390 and the reflection pattern1370 may be occurred. Thus, capacitance between the sensing pattern 1390and the reflection pattern 1370 is occurred, so that touch sensitivitymay be declined due to the capacitance between the sensing pattern 1390and the reflection pattern 1370.

However, in the illustrated exemplary embodiment, when a touch signal isapplied to a sensing pattern 1390, a signal having the same signal asthe touch signal is applied to the reflection pattern 1370. Thus,potential difference between the sensing pattern 1390 and the reflectionpattern 1370 may be not occurred. Thus, capacitance between the sensingpattern 1390 and the reflection pattern 1370 is not occurred, so thatdecline of touch sensitivity may be prevented.

FIG. 45 is a plan view illustrating an OLED device according to anexemplary embodiment of the invention. FIG. 46 is a cross-sectional viewtaken along line V-V′ of FIG. 45.

The OLED device according to the illustrated exemplary embodiment issubstantially same as the OLED device of FIGS. 1 and 2 except for areflection pattern 2370 and a contact hole CNT, and thus similarreference numerals are used for same elements and repetitive explanationwill be omitted.

Referring to FIGS. 45 and 46, a contact hole CNT is provided in a fourthinsulation layer 2385. The reflection pattern 2370 is electricallyconnected to a sensing pattern 2390 through the contact hole CNT.

The sensing pattern 2390 may function as a sensing electrode of a touchscreen panel of self capacitance type. In an exemplary embodiment, whenan electric conductor is contacted, capacitance of the sensing pattern2390 around a touch position is changed, for example. Thus, a touchpanel sensor (not shown) may decide a touch position based on acapacitance sensing signal corresponding to the change of capacitance.

The reflection pattern 2370 is provided as a similar size as the sensingpattern 2390 in a plan view. The reflection pattern 2370 is electricallyconnected to a sensing pattern 2390 through the contact hole CNT.Accordingly, sensing electrodes of a touch screen panel of selfcapacitance type may have low-resistance.

FIGS. 47 to 54 are cross-sectional views illustrating a method ofmanufacturing the OLED device of FIG. 46.

Referring to FIG. 47, the buffer layer 2115 is disposed on the firstsubstrate 2110. Thereafter, the active pattern 2130 and the firstinsulation layer 2150 are disposed on the buffer layer 2115.

In an exemplary embodiment, the first substrate 2110 may include atleast one of quartz, synthetic quartz, calcium fluoride, fluoride-dopingquartz, a sodalime glass, a non-alkali glass etc., for example.

A buffer layer 2115 may be disposed on the first substrate 2110. Thebuffer layer 2115 may extend from the light-emitting region II into thereflection region III. The buffer layer 2115 may prevent the diffusion(e.g., an out gassing) of metal atoms and/or impurities from the firstsubstrate 2110. Additionally, the buffer layer 2115 may control a rateof a heat transfer in a crystallization process for forming the activepattern 2130, thereby obtaining substantially uniform the active pattern2130. Furthermore, the buffer layer 2115 may improve a surface flatnessof the first substrate 2110 when a surface of the first substrate 2110is relatively irregular. According to a type of the first substrate2110, at least two buffer layers may be provided on the first substrate2110, or the buffer layer may not be disposed.

In an exemplary embodiment, the active pattern 2130 may include at leastone of an oxide semiconductor, an inorganic semiconductor (e.g.,amorphous silicon, polysilicon, etc.), an organic semiconductor, etc.,for example.

The first insulation layer 2150 may be disposed on the active pattern2130. The first insulation layer 2150 may cover the active pattern 2130in the light-emitting region II, and may extend in the first directionon the first substrate 2110. That is, the first insulation layer 2150may be disposed on the entire first substrate 2110. In an exemplaryembodiment, the first insulation layer 2150 may include at least one ofa silicon compound, a metal oxide, etc., for example.

Referring to FIG. 48, the gate electrode 2170 and the second insulationlayer 2190 is disposed on the first substrate 2110 on which the firstinsulation layer 2150 is disposed.

The gate electrode 2170 may be disposed on a portion of the firstinsulation layer 2150 under which the active pattern 2130 is disposed.In an exemplary embodiment, the gate electrode 2170 may include at leastone of a metal, an alloy, metal nitride, conductive metal oxide,transparent conductive materials, etc., for example.

The second insulation layer 2190 may be disposed on the gate electrode2170. The second insulation layer 2190 may cover the gate electrode 2170in the light-emitting region II, and may extend in the first directionon the first substrate 2110. That is, the second insulation layer 2190may be disposed on the entire first substrate 2110. In an exemplaryembodiment, the second insulation layer 2190 may include at least one ofa silicon compound, a metal oxide, etc., for example.

Referring to FIG. 49, the source electrode 2210 and the drain electrode2230 are disposed on the first substrate 2110 on which the secondinsulation layer 2190 is disposed.

The source electrode 2210 and the drain electrode 2230 may be disposedon the second insulation layer 2190. The source electrode 2210 maycontact a first side of the active layer 2130 by removing a portion ofthe first and second insulation layers 2150 and 2190. The drainelectrode 2230 may contact a second side of the active layer 2130 byremoving a second portion of the first and second insulation layers 2150and 2190. In an exemplary embodiment, each of the source electrode 2210and the drain electrode 2230 may include at least one of a metal, analloy, metal nitride, conductive metal oxide, transparent conductivematerials, etc., for example.

Referring to FIG. 50, the third insulation layer 2270 and the lowerelectrode 2290 are disposed on the first substrate 2110 on which thesource electrode 2210 and the drain electrode 2230 are disposed.

The third insulation layer 2270 may be disposed on the source electrode2210 and the drain electrode 2230. The third insulation layer 2270 maycover the source electrode 2210 and the drain electrode 2230 in thesub-pixel region II, and may extend in the first direction on the firstsubstrate 2110. That is, the third insulation layer 2270 may be disposedon the entire first substrate 2110. In an exemplary embodiment, thethird insulation layer 2270 may include at least one of a siliconcompound, a metal oxide, etc., for example.

The lower electrode 2290 may be disposed on the third insulation layer2270. The lower electrode 2290 may contact the drain electrode 2230 byremoving a portion of the third insulation layer 2270. In addition, thelower electrode 2290 may be electrically connected to the semiconductorelement 2250. In an exemplary embodiment, the lower electrode 2290 mayinclude at least one of a metal, an alloy, metal nitride, conductivemetal oxide, transparent conductive materials, etc., for example.

Referring to FIG. 51, the pixel defining layer 2310, the light emittinglayer 2330 and the upper electrode 2340 are disposed on the firstsubstrate 2110 on which the lower electrode 2290 is disposed.

The pixel defining layer 2310 may be disposed the on third insulationlayer 2270 to expose a portion of the lower electrode 2290. The pixeldefining layer 2310 may include organic materials or inorganicmaterials. In this case, the light emitting layer 2330 may be disposedon a portion that the lower electrode 2290 is exposed by the pixeldefining layer 2310.

The light emitting layer 2330 may be disposed on the exposed lowerelectrode 2290. The light emitting layer 2330 may be provided usinglight emitting materials generating different colors of light (e.g., ared color of light, a blue color of light, and a green color of light).

The upper electrode 2340 may be disposed on the pixel defining layer2310 and the light emitting layer 2330. The upper electrode 2340 maycover the pixel defining layer 2310 and the light emitting layer 2330 inlight-emitting region II and the reflection region III, and may extendin the first direction on the first substrate 2110. That is, the upperelectrode 2340 may be electrically connected to the first through thirdpixels. In an exemplary embodiment, the upper electrode 2340 may includeat least one of a metal, an alloy, metal nitride, conductive metaloxide, a transparent conductive material, etc., for example. These maybe used alone or in a combination thereof.

Referring to FIG. 52, the sensing pattern 2390 is disposed on the secondsubstrate 2350.

The sensing pattern 2390 may be disposed on a first surface of thesecond substrate 2350. The sensing pattern 2390 may be disposed betweenthe first substrate 2110 and the second substrate 2350. The sensingpattern 2390 may be disposed in the light-emitting region II and thereflection region III.

The sensing pattern 2390 may include a material having a predeterminedreflectivity. In an exemplary embodiment, the sensing pattern 2390 mayinclude at least one of gold (Au), silver (Ag), aluminum (Al), magnesium(Mg), platinum (Pt), Nickel (Ni), titanium (Ti), etc., for example. Inan alternative exemplary embodiment, the sensing pattern 2390 mayinclude at least one of an alloy, metal nitride, conductive metal oxide,etc. In an exemplary embodiment, the sensing pattern 2390 may include atleast one of an alloy including aluminum, aluminum nitride (AlNx), analloy including silver, tungsten nitride (WNx), an alloy includingcopper, chrome nitride (CrNx), an alloy including molybdenum, titaniumnitride (TiNx), tantalum nitride (TaNx), SRO, zinc oxide (ZnOx), stannumoxide (SnOx), indium oxide (InOx), gallium oxide (GaOx), etc., forexample.

The second substrate 2350 and the first substrate 2110 may includesubstantially the same materials. In an exemplary embodiment, the secondsubstrate 2350 may include at least one of quartz, synthetic quartz,calcium fluoride, fluoride-doping quartz, sodalime glass, non-alkaliglass etc., for example.

Referring to FIG. 53, the fourth insulation layer 2385 is disposed onthe second substrate 2350 on which the sensing pattern 2390 is disposed.Thereafter, the fourth insulation layer 2385 is patterned to define thecontact hole CNT.

The fourth insulation layer 2385 may prevent from oxidation of thesensing pattern 2390. The fourth insulation layer 2385 may include anadhesive material. The fourth insulation layer 2385 may prevent fromseparating of the reflection pattern 2370 and the sensing pattern 2390from the second substrate 2350. The fourth insulation layer 2385 mayinsulate between the reflection pattern 2370 and the sensing pattern2390.

Referring to FIG. 54, the reflection pattern 2370 is disposed on thefourth insulation layer 2385 in which the contact hole CNT is defined.

The reflection pattern 2370 may be disposed in the reflection regionIII. The reflection pattern 2370 is electrically connected to a sensingpattern 2390 through the contact hole CNT. Accordingly, sensingelectrodes of a touch screen panel of self capacitance type may havelow-resistance.

The reflection pattern 2370 may include a material having apredetermined reflectivity. In an exemplary embodiment, the reflectionpattern 2370 may include at least one of gold (Au), silver (Ag),aluminum (Al), magnesium (Mg), platinum (Pt), Nickel (Ni), titanium(Ti), etc., for example. In an alternative exemplary embodiment, thereflection pattern 2370 may include at least one of an alloy, metalnitride, conductive metal oxide, etc., for example. In an exemplaryembodiment, the reflection pattern 2370 may include at least one of analloy including aluminum, aluminum nitride (AlNx), an alloy includingsilver, tungsten nitride (WNx), an alloy including copper, chromenitride (CrNx), an alloy including molybdenum, titanium nitride (TiNx),tantalum nitride (TaNx), SRO, zinc oxide (ZnOx), stannum oxide (SnOx),indium oxide (InOx), gallium oxide (GaOx), etc., for example.

FIG. 55 is a plan view illustrating a reflection pattern of FIG. 46.FIG. 56 is a plan view illustrating a sensing pattern of FIG. 46. FIG.57 is a plan view illustrating the reflection pattern of FIG. 55 and thesensing pattern of FIG. 56.

Referring to FIG. 46 and FIGS. 55 to 57, the reflection pattern 2370 andthe sensing pattern 2390 are illustrated.

The reflection pattern 2370 is disposed only in the reflection regionIII. Thus, the reflection pattern 2370 is not disposed in a region thatthe Pixels 60, 70, and 80 are disposed. The reflection pattern 2370 isprovided as one pattern. The reflection pattern 2370 is provided as asimilar size as the sensing pattern 2390 in a plan view.

The sensing pattern 2390 is disposed in the light-emitting region II andthe reflection region III. The sensing pattern 2390 may be electricallyconnected to a sensing driver (not shown) through a connection line2395. The connection line 2395 may include the same material as that ofthe sensing pattern 2390. The connection line 2395 may disposed on thesame layer as the sensing pattern 2390. However, the invention is notlimited thereto, and the connection line 2395 may include differentmaterial from the sensing pattern 2390.

The sensing pattern 2390 may function as a sensing electrode of a touchscreen panel of self capacitance type. In an exemplary embodiment, whenan electric conductor is contacted, capacitance of the sensing pattern2390 around a touch position is changed, for example. Thus, a touchpanel sensor (not shown) may decide a touch position based on acapacitance sensing signal corresponding to the change of capacitance.

The sensing pattern 2390 may have a size corresponding to apredetermined number of unit pixels Px. The sensing pattern 2390 mayhave an appropriate size according to a size of a display device.

The reflection pattern 2370 is provided as a similar size as the sensingpattern 2390 in a plan view. The reflection pattern 2370 is electricallyconnected to a sensing pattern 2390 through the contact hole CNT.Accordingly, sensing electrodes of a touch screen panel of selfcapacitance type may have low-resistance.

FIG. 58 is a plan view illustrating an OLED device according to anexemplary embodiment of the invention. FIG. 59 is a cross-sectional viewtaken along line VI-VI′ of FIG. 58

The OLED device according to the illustrated exemplary embodiment issubstantially same as the OLED device of FIGS. 1 and 2 except for areflection pattern 3370, a thin film encapsulation layer 3410, a fourthinsulation layer 3420 and a sensing pattern 3370 and thus similarreference numerals are used for same elements and repetitive explanationwill be omitted.

Referring to FIGS. 58 and 59, the thin film encapsulation layer 3410 isdisposed on an upper electrode 3340. The thin film encapsulation layer3410 may be provided by stacking (e.g., sequentially stacking) a firstinorganic layer, an organic layer, and a second inorganic layer.

In an exemplary embodiment, the organic layer may include a polymer, andmay also be a single layer or multiple layers (e.g., stacked layers)that includes, for example, one of polyethylene terephthalate, apolyimide, a polycarbonate, an epoxy, a polyethylene and a polyacrylate.In an exemplary embodiment, the organic layer may also include apolyacrylate, for example, and the organic layer may include apolymerized monomer composition including a diacrylate monomer or atriacrylate monomer. The monomer composition may further include amonoacrylate monomer. The monomer composition may further include asuitable photoinitiator such as thermoplastic polyolefin (“TPO”), but isnot limited thereto.

The first inorganic layer and the second inorganic layer may be singlelayers or stacked layers including a metal oxide or a metal nitride. Inan exemplary embodiment, the first inorganic layer and the secondinorganic layer may include at least one of silicon nitride (e.g.,SiNx), aluminum oxide (e.g., Al2O3), silicon oxide (e.g., SiO2), andtitanium oxide (e.g., TiO2). In this case, the second inorganic layermay prevent or reduce moisture from permeating into the light-emittingstructure.

The sensing pattern 3390 is disposed on the thin film encapsulationlayer 3410. The sensing pattern 3390 may be disposed in thelight-emitting region II and the reflection region III.

The sensing pattern 3390 may include a material having a predeterminedreflectivity. In an exemplary embodiment, the sensing pattern 3390 mayinclude at least one of gold (Au), silver (Ag), aluminum (Al), magnesium(Mg), platinum (Pt), Nickel (Ni), titanium (Ti), etc., for example. Inan alternative exemplary embodiment, the sensing pattern 3390 mayinclude at least one of an alloy, metal nitride, conductive metal oxide,etc., for example. In an exemplary embodiment, the sensing pattern 3390may include at least one of an alloy including aluminum, aluminumnitride (AlNx), an alloy including silver, tungsten nitride (WNx), analloy including copper, chrome nitride (CrNx), an alloy includingmolybdenum, titanium nitride (TiNx), tantalum nitride (TaNx), SRO, zincoxide (ZnOx), stannum oxide (SnOx), indium oxide (InOx), gallium oxide(GaOx), etc., for example.

The fourth insulation layer 3420 is disposed on the sensing pattern3390. The fourth insulation layer 3420 may include an adhesive material.

The reflection pattern 3370 is disposed on the fourth insulation layer3420. The reflection pattern 3370 may be disposed in the reflectionregion III.

The reflection pattern 3370 may include a material having apredetermined reflectivity. In an exemplary embodiment, the reflectionpattern 3370 may include at least one of gold (Au), silver (Ag),aluminum (Al), magnesium (Mg), platinum (Pt), Nickel (Ni), titanium(Ti), etc., for example. In an alternative exemplary embodiment, thereflection pattern 3370 may include at least one of an alloy, metalnitride, conductive metal oxide, etc., for example. In an exemplaryembodiment, the reflection pattern 3370 may include at least one of analloy including aluminum, aluminum nitride (AlNx), an alloy includingsilver, tungsten nitride (WNx), an alloy including copper, chromenitride (CrNx), an alloy including molybdenum, titanium nitride (TiNx),tantalum nitride (TaNx), SRO, zinc oxide (ZnOx), stannum oxide (SnOx),indium oxide (InOx), gallium oxide (GaOx), etc., for example.

The sensing pattern 3390 may function as a sensing electrode of a touchscreen panel of self capacitance type. In an exemplary embodiment, whenan electric conductor is contacted, capacitance of the sensing pattern3390 around a touch position is changed, for example. Thus, a touchpanel sensor (not shown) may decide a touch position based on acapacitance sensing signal corresponding to the change of capacitance.However, the invention is not limited thereto, and the reflectionpattern 3370 may function as a sensing electrode of a touch screen panelof self capacitance type. In addition, both the reflection pattern 3370and the sensing pattern 3390 may function as a sensing electrode of atouch screen panel of self capacitance type.

FIGS. 60 to 67 are cross-sectional views illustrating a method ofmanufacturing the OLED device of FIG. 59.

Referring to FIG. 60, the buffer layer 3115 is disposed on the firstsubstrate 3110. Thereafter, the active pattern 3130 and the firstinsulation layer 3150 are disposed on the buffer layer 3115.

In an exemplary embodiment, the first substrate 3110 may include atleast one of quartz, synthetic quartz, calcium fluoride, fluoride-dopingquartz, a sodalime glass, a non-alkali glass etc., for example.

A buffer layer 3115 may be disposed on the first substrate 3110. Thebuffer layer 3115 may extend from the light-emitting region II into thereflection region III. The buffer layer 3115 may prevent the diffusion(e.g., an out gassing) of metal atoms and/or impurities from the firstsubstrate 3110. Additionally, the buffer layer 3115 may control a rateof a heat transfer in a crystallization process for forming the activepattern 3130, thereby obtaining substantially uniform the active pattern3130. Furthermore, the buffer layer 3115 may improve a surface flatnessof the first substrate 3110 when a surface of the first substrate 3110is relatively irregular. According to a type of the first substrate3110, at least two buffer layers may be provided on the first substrate3110, or the buffer layer may not be disposed.

In an exemplary embodiment, the active pattern 3130 may include at leastone of an oxide semiconductor, an inorganic semiconductor (e.g.,amorphous silicon, polysilicon, etc.), an organic semiconductor, etc.,for example.

The first insulation layer 3150 may be disposed on the active pattern3130. The first insulation layer 3150 may cover the active pattern 3130in the light-emitting region II, and may extend in the first directionon the first substrate 3110. That is, the first insulation layer 3150may be disposed on the entire first substrate 3110. In an exemplaryembodiment, the first insulation layer 3150 may include at least one ofa silicon compound, a metal oxide, etc., for example.

Referring to FIG. 61, the gate electrode 3170 and the second insulationlayer 3190 are disposed on the first substrate 3110 on which the firstinsulation layer 3150 is disposed.

The gate electrode 3170 may be disposed on a portion of the firstinsulation layer 3150 under which the active pattern 3130 is disposed.In an exemplary embodiment, the gate electrode 3170 may include at leastone of a metal, an alloy, metal nitride, conductive metal oxide,transparent conductive materials, etc., for example.

The second insulation layer 3190 may be disposed on the gate electrode3170. The second insulation layer 3190 may cover the gate electrode 3170in the light-emitting region II, and may extend in the first directionon the first substrate 3110. That is, the second insulation layer 3190may be disposed on the entire first substrate 3110. In an exemplaryembodiment, the second insulation layer 3190 may include at least one ofa silicon compound, a metal oxide, etc., for example.

Referring to FIG. 62, the source electrode 3210 and the drain electrode3230 are disposed on the first substrate 3110 on which the secondinsulation layer 3190 is disposed.

The source electrode 3210 and the drain electrode 3230 may be disposedon the second insulation layer 3190. The source electrode 3210 maycontact a first side of the active layer 3130 by removing a portion ofthe first and second insulation layers 3150 and 3190. The drainelectrode 3230 may contact a second side of the active layer 3130 byremoving a second portion of the first and second insulation layers 3150and 3190. In an exemplary embodiment, each of the source electrode 3210and the drain electrode 3230 may include at least one of a metal, analloy, metal nitride, conductive metal oxide, transparent conductivematerials, etc., for example.

Referring to FIG. 63, the third insulation layer 3270 and the lowerelectrode 3290 are disposed on the first substrate 3110 on which thesource electrode 3210 and the drain electrode 3230 are disposed.

The third insulation layer 3270 may be disposed on the source electrode3210 and the drain electrode 3230. The third insulation layer 3270 maycover the source electrode 3210 and the drain electrode 3230 in thesub-pixel region II, and may extend in the first direction on the firstsubstrate 3110. That is, the third insulation layer 3270 may be disposedon the entire first substrate 3110. In an exemplary embodiment, thethird insulation layer 3270 may include at least one of a siliconcompound, a metal oxide, etc., for example.

The lower electrode 3290 may be disposed on the third insulation layer3270. The lower electrode 3290 may contact the drain electrode 3230 byremoving a portion of the third insulation layer 3270. In addition, thelower electrode 3290 may be electrically connected to the semiconductorelement 3250. In an exemplary embodiment, the lower electrode 3290 mayinclude at least one of a metal, an alloy, metal nitride, conductivemetal oxide, transparent conductive materials, etc., for example.

Referring to FIG. 64, the pixel defining layer 3310, the light emittinglayer 3330 and the upper electrode 3340 are disposed on the firstsubstrate 3110 on which the lower electrode 3290 is disposed.

The pixel defining layer 3310 may be disposed the on third insulationlayer 3270 to expose a portion of the lower electrode 3290. The pixeldefining layer 3310 may include organic materials or inorganicmaterials. In this case, the light emitting layer 3330 may be disposedon a portion that the lower electrode 3290 is exposed by the pixeldefining layer 3310.

The light emitting layer 3330 may be disposed on the exposed lowerelectrode 3290. The light emitting layer 3330 may be provided usinglight emitting materials generating different colors of light (e.g., ared color of light, a blue color of light, and a green color of light).

The upper electrode 3340 may be disposed on the pixel defining layer3310 and the light emitting layer 3330. The upper electrode 3340 maycover the pixel defining layer 3310 and the light emitting layer 3330 inlight-emitting region II and the reflection region III, and may extendin the first direction on the first substrate 3110. That is, the upperelectrode 3340 may be electrically connected to the first through thirdpixels. In an exemplary embodiment, the upper electrode 3340 may includeat least one of a metal, an alloy, metal nitride, conductive metaloxide, a transparent conductive material, etc., for example. These maybe used alone or in a combination thereof.

Referring to FIG. 65, the thin film encapsulation layer 3410 is disposedon the first substrate 3110 on which the upper electrode 3340 isdisposed.

The thin film encapsulation layer 3410 may be provided by stacking(e.g., sequentially stacking) a first inorganic layer, an organic layer,and a second inorganic layer.

In an exemplary embodiment, the organic layer may include a polymer, andmay also be a single layer or multiple layers (e.g., stacked layers)that includes, for example, one of polyethylene terephthalate, apolyimide, a polycarbonate, an epoxy, a polyethylene and a polyacrylate.In an exemplary embodiment, the organic layer may also include apolyacrylate, for example, the organic layer may include a polymerizedmonomer composition including a diacrylate monomer or a triacrylatemonomer. The monomer composition may further include a monoacrylatemonomer. The monomer composition may further include a suitablephotoinitiator such as TPO, but is not limited thereto.

The first inorganic layer and the second inorganic layer may be singlelayers or stacked layers including a metal oxide or a metal nitride. Inan exemplary embodiment, the first inorganic layer and the secondinorganic layer may include at least one of silicon nitride (e.g.,SiNx), aluminum oxide (e.g., Al2O3), silicon oxide (e.g., SiO2), andtitanium oxide (e.g., TiO2), for example. In this case, the secondinorganic layer may prevent or reduce moisture from permeating into thelight-emitting structure.

Referring to FIG. 66, the sensing pattern 3390 is disposed on the firstsubstrate 3110 on which the thin film encapsulation layer 3410 isdisposed.

The sensing pattern 3390 may be disposed in the light-emitting region IIand the reflection region III.

The sensing pattern 3390 may include a material having a predeterminedreflectivity. In an exemplary embodiment, the sensing pattern 3390 mayinclude at least one of gold (Au), silver (Ag), aluminum (Al), magnesium(Mg), platinum (Pt), Nickel (Ni), titanium (Ti), etc., for example. Inan alternative exemplary embodiment, the sensing pattern 3390 mayinclude at least one of an alloy, metal nitride, conductive metal oxide,etc., for example. In an exemplary embodiment, the sensing pattern 3390may include at least one of an alloy including aluminum, aluminumnitride (AlNx), an alloy including silver, tungsten nitride (WNx), analloy including copper, chrome nitride (CrNx), an alloy includingmolybdenum, titanium nitride (TiNx), tantalum nitride (TaNx), SRO, zincoxide (ZnOx), stannum oxide (SnOx), indium oxide (InOx), gallium oxide(GaOx), etc., for example.

Referring to FIG. 67, the fourth insulation layer 3420 is disposed onthe first substrate 3110 on which the sensing pattern 3390 is disposed.

The fourth insulation layer 3420 is disposed on the sensing pattern3390. The fourth insulation layer 3420 may prevent from oxidation of thesensing pattern 3390. The fourth insulation layer 3420 may include anadhesive material. The fourth insulation layer 3420 may insulate betweenthe reflection pattern 3370 and the sensing pattern 3390.

Referring to FIG. 59, the reflection pattern 3370 is disposed on thefirst substrate 3110 on which the fourth insulation layer 3420 isdisposed.

The reflection pattern 3370 may be disposed in the reflection regionIII.

The reflection pattern 3370 may include a material having apredetermined reflectivity. In an exemplary embodiment, the reflectionpattern 3370 may include at least one of gold (Au), silver (Ag),aluminum (Al), magnesium (Mg), platinum (Pt), Nickel (Ni), titanium(Ti), etc., for example. In an alternative exemplary embodiment, thereflection pattern 3370 may include at least one of an alloy, metalnitride, conductive metal oxide, etc., for example. In an exemplaryembodiment, the reflection pattern 3370 may include at least one of analloy including aluminum, aluminum nitride (AlNx), an alloy includingsilver, tungsten nitride (WNx), an alloy including copper, chromenitride (CrNx), an alloy including molybdenum, titanium nitride (TiNx),tantalum nitride (TaNx), SRO, zinc oxide (ZnOx), stannum oxide (SnOx),indium oxide (InOx), gallium oxide (GaOx), etc., for example.

FIG. 68 is a plan view illustrating a reflection pattern of FIG. 59.FIG. 69 is a plan view illustrating a sensing pattern of FIG. 59. FIG.70 is a plan view illustrating the reflection pattern of FIG. 68 and thesensing pattern of FIG. 69.

Referring to FIG. 59 and FIGS. 68 to 70, the reflection pattern 3370 andthe sensing pattern 3390 are illustrated.

The reflection pattern 3370 is disposed only in the reflection regionIII. Thus, the reflection pattern 3370 is not disposed in a region thatthe Pixels 60, 70, and 80 are disposed. The reflection pattern 3370 isprovided as one pattern.

The sensing pattern 3390 is disposed in the light-emitting region II andthe reflection region III. The sensing pattern 3390 may be electricallyconnected to a sensing driver (not shown) through a connection line3395. The connection line 3395 may include the same material as that ofthe sensing pattern 3390. The connection line 3395 may disposed on thesame layer as the sensing pattern 3390. However, the invention is notlimited thereto, and the connection line 3395 may include differentmaterial from the sensing pattern 3390.

The sensing pattern 3390 may function as a sensing electrode of a touchscreen panel of self capacitance type. In an exemplary embodiment, whenan electric conductor is contacted, capacitance of the sensing pattern3390 around a touch position is changed, for example. Thus, a touchpanel sensor (not shown) may decide a touch position based on acapacitance sensing signal corresponding to the change of capacitance.

The sensing pattern 3390 may have a size corresponding to apredetermined number of unit pixels Px. The sensing pattern 3390 mayhave an appropriate size according to a size of a display device.

FIG. 71 is a plan view illustrating a reflection pattern of FIG. 59.FIG. 72 is a plan view illustrating a sensing pattern of FIG. 59. FIG.73 is a plan view illustrating the reflection pattern of FIG. 71 and thesensing pattern of FIG. 72.

Referring to FIG. 59 and FIGS. 71 to 73, the reflection pattern 3370 andthe sensing pattern 3390 are illustrated.

The reflection pattern 3370 is disposed only in the reflection regionIII. Thus, the reflection pattern 3370 is not disposed in a region thatthe Pixels 60, 70, and 80 are disposed. The reflection pattern 3370 mayfunction as a sensing electrode of a touch screen panel of selfcapacitance type. The reflection pattern 3370 may have a sizecorresponding to a predetermined number of unit pixels Px. Thereflection pattern 3370 may have an appropriate size according to a sizeof a display device.

The reflection pattern 3370 may be electrically connected to a sensingdriver (not shown) through a first connection line 3375. The firstconnection line 3375 may include the same material as that of thereflection pattern 3370. The first connection line 3375 may disposed onthe same layer as the reflection pattern 3370. However, the invention isnot limited thereto, and the first connection line 3375 may includedifferent material from the reflection pattern 3370.

The sensing pattern 3390 is disposed in the light-emitting region II andthe reflection region III. The sensing pattern 3390 may be electricallyconnected to a sensing driver (not shown) through a second connectionline 3395. The second connection line 3395 may include the same materialas that of the sensing pattern 3390. The second connection line 3395 maydisposed on the same layer as the sensing pattern 3390. However, theinvention is not limited thereto, and the second connection line 3395may include different material from the sensing pattern 3390.

The sensing pattern 3390 may function as a sensing electrode of a touchscreen panel of self capacitance type. In an exemplary embodiment, whenan electric conductor is contacted, capacitance of the sensing pattern3390 around a touch position is changed, for example. Thus, a touchpanel sensor (not shown) may decide a touch position based on acapacitance sensing signal corresponding to the change of capacitance.

The sensing pattern 3390 may have a size corresponding to apredetermined number of unit pixels Px. The sensing pattern 3390 mayhave an appropriate size according to a size of a display device.

In the illustrated exemplary embodiment, a size of the reflectionpattern 3370 may be bigger than a size of the sensing pattern 3390. Inan exemplary embodiment, the reflection pattern 3370 may have a sizecorresponding to four reflection patterns 3370. However, the inventionis not limited thereto, and the reflection pattern 3370 may have avarious size.

Since the reflection pattern 3370 is provided as relatively big area,the reflection pattern 3370 may detect touch position of a wide range.Thus, reflection pattern 3370 senses a touch position of a wide range,and after the reflection pattern 3370 senses the touch position, thesensing pattern 3390 senses an accurate touch position. Accordingly,high speed driving of a touch screen panel may be performed.

FIG. 74 is a plan view illustrating a reflection pattern of FIG. 59.FIG. 75 is a plan view illustrating a sensing pattern of FIG. 59. FIG.76 is a plan view illustrating the reflection pattern of FIG. 74 and thesensing pattern of FIG. 75.

Referring to FIG. 59 and FIGS. 74 to 76, the reflection pattern 3370 andthe sensing pattern 3390 are illustrated.

The reflection pattern 3370 is disposed only in the reflection regionIII. Thus, the reflection pattern 3370 is not disposed in a region thatthe Pixels 60, 70, and 80 are disposed. The reflection pattern 3370 isprovided as one pattern.

The sensing pattern 3390 is disposed in the light-emitting region II andthe reflection region III. The sensing pattern 3390 may be electricallyconnected to a sensing driver (not shown) through a connection line3395. The connection line 3395 may include the same material as that ofthe sensing pattern 3390. The connection line 3395 may disposed on thesame layer as the sensing pattern 3390. However, the invention is notlimited thereto, and the connection line 3395 may include differentmaterial from the sensing pattern 3390.

The sensing pattern 3390 may function as a sensing electrode of a touchscreen panel of self capacitance type. In an exemplary embodiment, whenan electric conductor is contacted, capacitance of the sensing pattern3390 around a touch position is changed, for example. Thus, a touchpanel sensor (not shown) may decide a touch position based on acapacitance sensing signal corresponding to the change of capacitance.

The sensing pattern 3390 may have a size corresponding to apredetermined number of unit pixels Px. The sensing pattern 3390 mayhave an appropriate size according to a size of a display device.

In the illustrated exemplary embodiment, the sensing patterns 3390classified as a plurality of sensing groups comprising a predeterminednumber of sensing patterns. In an exemplary embodiment, sensing patternsof A group are electrically connected to a first group driver 3510, andsensing patterns of B group are electrically connected to a second groupdriver 3520, for example. The first group driver 3510 and the secondgroup driver 3520 are electrically connected to a sensing driver 3600.

When a touch signal is applied to the sensing patterns 3390, a sensinggroup to which the touch signal is applied is detected, and an accuratetouch position in the sensing group to which the touch signal is appliedis detected. Accordingly, high speed driving of a touch screen panel maybe performed.

FIG. 77 is a plan view illustrating a reflection pattern of FIG. 59.FIG. 78 is a plan view illustrating a sensing pattern of FIG. 59. FIG.79 is a plan view illustrating the reflection pattern of FIG. 77 and thesensing pattern of FIG. 78.

Referring to FIG. 59 and FIGS. 77 to 79, the reflection pattern 3370 andthe sensing pattern 3390 are illustrated.

The reflection pattern 3370 is disposed only in the reflection regionIII. Thus, the reflection pattern 3370 is not disposed in a region thatthe Pixels 60, 70, and 80 are disposed. The reflection pattern 3370 maybe electrically connected to a sensing driver (not shown) through afirst connection line 3375. The first connection line 3375 may includethe same material as that of the reflection pattern 3370. The firstconnection line 3375 may disposed on the same layer as the reflectionpattern 3370. However, the invention is not limited thereto, and thefirst connection line 3375 may include different material from thereflection pattern 3370.

The sensing pattern 3390 is disposed in the light-emitting region II andthe reflection region III. The sensing pattern 3390 may be electricallyconnected to a sensing driver (not shown) through a second connectionline 3395. The second connection line 3395 may include the same materialas that of the sensing pattern 3390. The second connection line 3395 maydisposed on the same layer as the sensing pattern 3390. However, theinvention is not limited thereto, and the second connection line 3395may include different material from the sensing pattern 3390.

The sensing pattern 3390 may function as a sensing electrode of a touchscreen panel of self capacitance type. In an exemplary embodiment, whenan electric conductor is contacted, capacitance of the sensing pattern3390 around a touch position is changed, for example. Thus, a touchpanel sensor (not shown) may decide a touch position based on acapacitance sensing signal corresponding to the change of capacitance.

The sensing pattern 3390 may have a size corresponding to apredetermined number of unit pixels Px. The sensing pattern 3390 mayhave an appropriate size according to a size of a display device.

In the illustrated exemplary embodiment, the sensing patterns 3390classified as a plurality of sensing groups comprising a predeterminednumber of sensing patterns. In an exemplary embodiment, sensing patternsof A group are electrically connected to a first group driver 3510, andsensing patterns of B group are electrically connected to a second groupdriver 3520, for example. The first group driver 3510 and the secondgroup driver 3520 are electrically connected to a sensing driver 3600.

When a touch signal is applied to the sensing patterns 3390, a sensinggroup to which the touch signal is applied is detected, and an accuratetouch position in the sensing group to which the touch signal is appliedis detected. Accordingly, high speed driving of a touch screen panel maybe performed.

When a touch signal is applied to the sensing pattern 3390, potentialdifference between the sensing pattern 3390 and the reflection pattern3370 may be occurred. Thus, capacitance between the sensing pattern 3390and the reflection pattern 3370 is occurred, so that touch sensitivitymay be declined due to the capacitance between the sensing pattern 3390and the reflection pattern 3370.

However, in the illustrated exemplary embodiment, when a touch signal isapplied to a sensing pattern 3390, a signal having the same signal asthe touch signal is applied to the reflection pattern 3370. Thus,potential difference between the sensing pattern 3390 and the reflectionpattern 3370 may be not occurred. Thus, capacitance between the sensingpattern 3390 and the reflection pattern 3370 is not occurred, so thatdecline of touch sensitivity may be prevented.

FIG. 83 is a plan view illustrating an OLED device according to anexemplary embodiment of the invention. FIG. 84 is a cross-sectional viewtaken along line VII-VII′ of FIG. 83.

The OLED device according to the illustrated exemplary embodiment issubstantially same as the OLED device of FIGS. 1 and 2 except for areflection pattern 4370, a first thin film encapsulation layer 4410, asecond thin film encapsulation layer 4420 and a sensing pattern 4370 andthus similar reference numerals are used for same elements andrepetitive explanation will be omitted.

Referring to FIGS. 83 and 84, a thin film encapsulation layer isdisposed on an upper electrode 4340. The thin film encapsulation layermay be provided by stacking (e.g., sequentially stacking) a firstinorganic layer, an organic layer, and a second inorganic layer.

In an exemplary embodiment, the organic layer may include a polymer, andmay also be a single layer or multiple layers (e.g., stacked layers)that includes, for example, one of polyethylene terephthalate, apolyimide, a polycarbonate, an epoxy, a polyethylene and a polyacrylate.In an exemplary embodiment, the organic layer may also include apolyacrylate, for example, the organic layer may include a polymerizedmonomer composition including a diacrylate monomer or a triacrylatemonomer. The monomer composition may further include a monoacrylatemonomer. The monomer composition may further include a suitablephotoinitiator such as TPO, but is not limited thereto.

The first inorganic layer and the second inorganic layer may be singlelayers or stacked layers including a metal oxide or a metal nitride. Inan exemplary embodiment, the first inorganic layer and the secondinorganic layer may include at least one of silicon nitride (e.g.,SiNx), aluminum oxide (e.g., Al2O3), silicon oxide (e.g., SiO2), andtitanium oxide (e.g., TiO2), for example. In this case, the secondinorganic layer may prevent or reduce moisture from permeating into thelight-emitting structure.

In the illustrated exemplary embodiment, the thin film encapsulationlayer may include a first thin film encapsulation layer 4410 and asecond thin film encapsulation layer 4420. In an exemplary embodiment,the first thin film encapsulation layer 4410 may have the firstinorganic layer and the organic layer. The second thin filmencapsulation layer 4410 may have the second inorganic layer, but is notlimited thereto.

The sensing pattern 4390 is disposed on the first thin filmencapsulation layer 4410. The sensing pattern 4390 may be disposed inthe light-emitting region II and the reflection region III.

The sensing pattern 4390 may include a material having a predeterminedreflectivity. In an exemplary embodiment, the sensing pattern 4390 mayinclude at least one of gold (Au), silver (Ag), aluminum (Al), magnesium(Mg), platinum (Pt), Nickel (Ni), titanium (Ti), etc., for example. Inan alternative exemplary embodiment, the sensing pattern 4390 mayinclude at least one of an alloy, metal nitride, conductive metal oxide,etc., for example. In an exemplary embodiment, the sensing pattern 4390may include at least one of an alloy including aluminum, aluminumnitride (AlNx), an alloy including silver, tungsten nitride (WNx), analloy including copper, chrome nitride (CrNx), an alloy includingmolybdenum, titanium nitride (TiNx), tantalum nitride (TaNx), SRO, zincoxide (ZnOx), stannum oxide (SnOx), indium oxide (InOx), gallium oxide(GaOx), etc., for example.

The second thin film encapsulation layer 4420 is disposed on the sensingpattern 4390. The reflection pattern 4370 is disposed on the second thinfilm encapsulation layer 4420. The reflection pattern 4370 may bedisposed in the reflection region III.

The reflection pattern 4370 may include a material having apredetermined reflectivity. In an exemplary embodiment, the reflectionpattern 4370 may include at least one of gold (Au), silver (Ag),aluminum (Al), magnesium (Mg), platinum (Pt), Nickel (Ni), titanium(Ti), etc., for example. In an alternative exemplary embodiment, thereflection pattern 4370 may include at least one of an alloy, metalnitride, conductive metal oxide, etc., for example. In an exemplaryembodiment, the reflection pattern 4370 may include at least one of analloy including aluminum, aluminum nitride (AlNx), an alloy includingsilver, tungsten nitride (WNx), an alloy including copper, chromenitride (CrNx), an alloy including molybdenum, titanium nitride (TiNx),tantalum nitride (TaNx), SRO, zinc oxide (ZnOx), stannum oxide (SnOx),indium oxide (InOx), gallium oxide (GaOx), etc., for example.

The sensing pattern 4390 may function as a sensing electrode of a touchscreen panel of self capacitance type. In an exemplary embodiment, whenan electric conductor is contacted, capacitance of the sensing pattern4390 around a touch position is changed, for example. Thus, a touchpanel sensor (not shown) may decide a touch position based on acapacitance sensing signal corresponding to the change of capacitance.However, the invention is not limited thereto, and the reflectionpattern 4370 may function as a sensing electrode of a touch screen panelof self capacitance type. In addition, both the reflection pattern 4370and the sensing pattern 4390 may function as a sensing electrode of atouch screen panel of self capacitance type.

FIGS. 85 to 92 are cross-sectional views illustrating a method ofmanufacturing the OLED device of FIG. 84.

Referring to FIG. 85, the buffer layer 4115 is disposed on the firstsubstrate 4110. Thereafter, the active pattern 4130 and the firstinsulation layer 4150 are disposed on the buffer layer 4115.

In an exemplary embodiment, the first substrate 4110 may include atleast one of quartz, synthetic quartz, calcium fluoride, fluoride-dopingquartz, a sodalime glass, a non-alkali glass etc., for example.

A buffer layer 4115 may be disposed on the first substrate 4110. Thebuffer layer 4115 may extend from the light-emitting region II into thereflection region III. The buffer layer 4115 may prevent the diffusion(e.g., an out gassing) of metal atoms and/or impurities from the firstsubstrate 4110. Additionally, the buffer layer 4115 may control a rateof a heat transfer in a crystallization process for forming the activepattern 4130, thereby obtaining substantially uniform the active pattern4130. Furthermore, the buffer layer 4115 may improve a surface flatnessof the first substrate 4110 when a surface of the first substrate 4110is relatively irregular. According to a type of the first substrate4110, at least two buffer layers may be provided on the first substrate4110, or the buffer layer may not be disposed.

In an exemplary embodiment, the active pattern 4130 may include at leastone of an oxide semiconductor, an inorganic semiconductor (e.g.,amorphous silicon, polysilicon, etc.), an organic semiconductor, etc.,for example.

The first insulation layer 4150 may be disposed on the active pattern4130. The first insulation layer 4150 may cover the active pattern 4130in the light-emitting region II, and may extend in the first directionon the first substrate 4110. That is, the first insulation layer 4150may be disposed on the entire first substrate 4110. In an exemplaryembodiment, the first insulation layer 4150 may include at least one ofa silicon compound, a metal oxide, etc., for example.

Referring to FIG. 86, the gate electrode 4170 and the second insulationlayer 4190 are disposed on the first substrate 4110 on which the firstinsulation layer 4150 is disposed.

The gate electrode 4170 may be disposed on a portion of the firstinsulation layer 4150 under which the active pattern 4130 is disposed.In an exemplary embodiment, the gate electrode 4170 may include at leastone of a metal, an alloy, metal nitride, conductive metal oxide,transparent conductive materials, etc., for example.

The second insulation layer 4190 may be disposed on the gate electrode4170. The second insulation layer 4190 may cover the gate electrode 4170in the light-emitting region II, and may extend in the first directionon the first substrate 4110. That is, the second insulation layer 4190may be disposed on the entire first substrate 4110. In an exemplaryembodiment, the second insulation layer 4190 may include at least one ofa silicon compound, a metal oxide, etc., for example.

Referring to FIG. 87, the source electrode 4210 and the drain electrode4230 are disposed on the first substrate 4110 on which the secondinsulation layer 4190 is disposed.

The source electrode 4210 and the drain electrode 4230 may be disposedon the second insulation layer 4190. The source electrode 4210 maycontact a first side of the active layer 4130 by removing a portion ofthe first and second insulation layers 4150 and 4190. The drainelectrode 4230 may contact a second side of the active layer 4130 byremoving a second portion of the first and second insulation layers 4150and 4190. In an exemplary embodiment, each of the source electrode 4210and the drain electrode 4230 may include at least one of a metal, analloy, metal nitride, conductive metal oxide, transparent conductivematerials, etc., for example.

Referring to FIG. 88, the third insulation layer 4270 and the lowerelectrode 4290 are disposed on the first substrate 4110 on which thesource electrode 4210 and the drain electrode 4230 are disposed.

The third insulation layer 4270 may be disposed on the source electrode4210 and the drain electrode 4230. The third insulation layer 4270 maycover the source electrode 4210 and the drain electrode 4230 in thesub-pixel region II, and may extend in the first direction on the firstsubstrate 4110. That is, the third insulation layer 4270 may be disposedon the entire first substrate 4110. In an exemplary embodiment, thethird insulation layer 4270 may include at least one of a siliconcompound, a metal oxide, etc., for example.

The lower electrode 4290 may be disposed on the third insulation layer4270. The lower electrode 4290 may contact the drain electrode 4230 byremoving a portion of the third insulation layer 4270. In addition, thelower electrode 4290 may be electrically connected to the semiconductorelement 4250. In an exemplary embodiment, the lower electrode 4290 mayinclude at least one of a metal, an alloy, metal nitride, conductivemetal oxide, transparent conductive materials, etc., for example.

Referring to FIG. 89, the pixel defining layer 4310, the light emittinglayer 4330 and the upper electrode 4340 are disposed on the firstsubstrate 4110 on which the lower electrode 4290 is disposed.

The pixel defining layer 4310 may be disposed the on third insulationlayer 4270 to expose a portion of the lower electrode 4290. The pixeldefining layer 4310 may include organic materials or inorganicmaterials. In this case, the light emitting layer 4330 may be disposedon a portion that the lower electrode 4290 is exposed by the pixeldefining layer 4310.

The light emitting layer 4330 may be disposed on the exposed lowerelectrode 4290. The light emitting layer 4330 may be provided usinglight emitting materials generating different colors of light (e.g., ared color of light, a blue color of light, and a green color of light).

The upper electrode 4340 may be disposed on the pixel defining layer4310 and the light emitting layer 4330. The upper electrode 4340 maycover the pixel defining layer 4310 and the light emitting layer 4330 inlight-emitting region II and the reflection region III, and may extendin the first direction on the first substrate 4110. That is, the upperelectrode 4340 may be electrically connected to the first through thirdpixels. In an exemplary embodiment, the upper electrode 4340 may includeat least one of a metal, an alloy, metal nitride, conductive metaloxide, a transparent conductive material, etc., for example. These maybe used alone or in a combination thereof.

Referring to FIG. 65, the first thin film encapsulation layer 4410 isdisposed on the first substrate 4110 on which the upper electrode 4340is disposed.

In the illustrated exemplary embodiment, the thin film encapsulationlayer may include a first thin film encapsulation layer 4410 and asecond thin film encapsulation layer 4420. The thin film encapsulationlayer may be provided by stacking (e.g., sequentially stacking) a firstinorganic layer, an organic layer, and a second inorganic layer.

In an exemplary embodiment, the organic layer may include a polymer, andmay also be a single layer or multiple layers (e.g., stacked layers)that includes, for example, one of polyethylene terephthalate, apolyimide, a polycarbonate, an epoxy, a polyethylene and a polyacrylate.In an exemplary embodiment, the organic layer may also include apolyacrylate, for example, the organic layer may include a polymerizedmonomer composition including a diacrylate monomer or a triacrylatemonomer. The monomer composition may further include a monoacrylatemonomer. The monomer composition may further include a suitablephotoinitiator such as TPO, but is not limited thereto.

The first inorganic layer and the second inorganic layer may be singlelayers or stacked layers including a metal oxide or a metal nitride. Inan exemplary embodiment, the first inorganic layer and the secondinorganic layer may include at least one of silicon nitride (e.g.,SiNx), aluminum oxide (e.g., Al2O3), silicon oxide (e.g., SiO2), andtitanium oxide (e.g., TiO2), for example. In this case, the secondinorganic layer may prevent or reduce moisture from permeating into thelight-emitting structure.

The first thin film encapsulation layer 4410 may have the firstinorganic layer. However, the invention is not limited thereto, and thefirst thin film encapsulation layer 4410 may have the first inorganiclayer and the organic layer.

Referring to FIG. 91, the sensing pattern 4390 is disposed on the firstsubstrate 4110 on which the first thin film encapsulation layer 4410 isdisposed.

The sensing pattern 4390 may be disposed in the light-emitting region IIand the reflection region III.

The sensing pattern 4390 may include a material having a predeterminedreflectivity. In an exemplary embodiment, the sensing pattern 4390 mayinclude at least one of gold (Au), silver (Ag), aluminum (Al), magnesium(Mg), platinum (Pt), Nickel (Ni), titanium (Ti), etc., for example. Inan alternative exemplary embodiment, the sensing pattern 4390 mayinclude at least one of an alloy, metal nitride, conductive metal oxide,etc., for example. In an exemplary embodiment, the sensing pattern 4390may include at least one of an alloy including aluminum, aluminumnitride (AlNx), an alloy including silver, tungsten nitride (WNx), analloy including copper, chrome nitride (CrNx), an alloy includingmolybdenum, titanium nitride (TiNx), tantalum nitride (TaNx), SRO, zincoxide (ZnOx), stannum oxide (SnOx), indium oxide (InOx), gallium oxide(GaOx), etc., for example.

Referring to FIG. 92, the second thin film encapsulation layer 4420 isdisposed on the first substrate 4110 on which the sensing pattern 4390is disposed.

The second thin film encapsulation layer 4420 may have the secondinorganic layer. However, the invention is not limited thereto, and thesecond thin film encapsulation layer 4420 may have the organic layer andthe second inorganic layer.

A thin film encapsulation layer according to the illustrated exemplaryembodiment includes the first thin film encapsulation layer 4410 and thesecond thin film encapsulation layer 4420. In addition, the sensingpattern 4390 is disposed between the first thin film encapsulation layer4410 and the second thin film encapsulation layer 4420. That is, thesensing pattern 4390 is disposed in the thin film encapsulation layer.

Referring to FIG. 84, the reflection pattern 4370 is disposed on thefirst substrate 4110 on which second thin film encapsulation layer 4420is disposed.

The reflection pattern 4370 may be disposed in the reflection regionIII.

The reflection pattern 4370 may include a material having apredetermined reflectivity. In an exemplary embodiment, the reflectionpattern 4370 may include at least one of gold (Au), silver (Ag),aluminum (Al), magnesium (Mg), platinum (Pt), Nickel (Ni), titanium(Ti), etc., for example. In an alternative exemplary embodiment, thereflection pattern 4370 may include at least one of an alloy, metalnitride, conductive metal oxide, etc., for example. In an exemplaryembodiment, the reflection pattern 4370 may include at least one of analloy including aluminum, aluminum nitride (AlNx), an alloy includingsilver, tungsten nitride (WNx), an alloy including copper, chromenitride (CrNx), an alloy including molybdenum, titanium nitride (TiNx),tantalum nitride (TaNx), SRO, zinc oxide (ZnOx), stannum oxide (SnOx),indium oxide (InOx), gallium oxide (GaOx), etc., for example.

FIG. 93 is a plan view illustrating a reflection pattern of FIG. 84.FIG. 94 is a plan view illustrating a sensing pattern of FIG. 84. FIG.95 is a plan view illustrating the reflection pattern of FIG. 93 and thesensing pattern of FIG. 94

Referring to FIG. 84 and FIGS. 93 to 95, the reflection pattern 4370 andthe sensing pattern 4390 are illustrated.

The reflection pattern 4370 is disposed only in the reflection regionIII. Thus, the reflection pattern 4370 is not disposed in a region thatthe Pixels 60, 70, and 80 are disposed. The reflection pattern 4370 isprovided as one pattern.

The sensing pattern 4390 is disposed in the light-emitting region II andthe reflection region III. The sensing pattern 4390 may be electricallyconnected to a sensing driver (not shown) through a connection line4395. The connection line 395 may include the same material as that ofthe sensing pattern 4390. The connection line 4395 may disposed on thesame layer as the sensing pattern 4390. However, the invention is notlimited thereto, and the connection line 4395 may include differentmaterial from the sensing pattern 4390.

The sensing pattern 4390 may function as a sensing electrode of a touchscreen panel of self capacitance type. In an exemplary embodiment, whenan electric conductor is contacted, capacitance of the sensing pattern4390 around a touch position is changed, for example. Thus, a touchpanel sensor (not shown) may decide a touch position based on acapacitance sensing signal corresponding to the change of capacitance.

The sensing pattern 4390 may have a size corresponding to apredetermined number of unit pixels Px. The sensing pattern 4390 mayhave an appropriate size according to a size of a display device.

FIG. 96 is a plan view illustrating a reflection pattern of FIG. 84.FIG. 97 is a plan view illustrating a sensing pattern of FIG. 84. FIG.98 is a plan view illustrating the reflection pattern of FIG. 96 and thesensing pattern of FIG. 97.

Referring to FIG. 84 and FIGS. 96 to 98, the reflection pattern 4370 andthe sensing pattern 4390 are illustrated.

The reflection pattern 4370 is disposed only in the reflection regionIII. Thus, the reflection pattern 4370 is not disposed in a region thatthe Pixels 60, 70, and 80 are disposed. The reflection pattern 4370 mayfunction as a sensing electrode of a touch screen panel of selfcapacitance type. The reflection pattern 4370 may have a sizecorresponding to a predetermined number of unit pixels Px. Thereflection pattern 4370 may have an appropriate size according to a sizeof a display device.

The reflection pattern 4370 may be electrically connected to a sensingdriver (not shown) through a first connection line 4375. The firstconnection line 4375 may include the same material as that of thereflection pattern 4370. The first connection line 4375 may disposed onthe same layer as the reflection pattern 4370. However, the invention isnot limited thereto, and the first connection line 4375 may includedifferent material from the reflection pattern 4370.

The sensing pattern 4390 is disposed in the light-emitting region II andthe reflection region III. The sensing pattern 4390 may be electricallyconnected to a sensing driver (not shown) through a second connectionline 4395. The second connection line 4395 may include the same materialas that of the sensing pattern 4390. The second connection line 4395 maydisposed on the same layer as the sensing pattern 4390. However, theinvention is not limited thereto, and the second connection line 4395may include different material from the sensing pattern 4390.

The sensing pattern 4390 may function as a sensing electrode of a touchscreen panel of self capacitance type. In an exemplary embodiment, whenan electric conductor is contacted, capacitance of the sensing pattern4390 around a touch position is changed, for example. Thus, a touchpanel sensor (not shown) may decide a touch position based on acapacitance sensing signal corresponding to the change of capacitance.

The sensing pattern 4390 may have a size corresponding to apredetermined number of unit pixels Px. The sensing pattern 4390 mayhave an appropriate size according to a size of a display device.

In the illustrated exemplary embodiment, a size of the reflectionpattern 4370 may be bigger than a size of the sensing pattern 4390. Inan exemplary embodiment, the reflection pattern 4370 may have a sizecorresponding to four reflection patterns 4370, for example. However,the invention is not limited thereto, and the reflection pattern 4370may have a various size.

Since the reflection pattern 4370 is provided as relatively big area,the reflection pattern 4370 may detect touch position of a wide range.Thus, reflection pattern 4370 senses a touch position of a wide range,and after the reflection pattern 4370 senses the touch position, thesensing pattern 4390 senses an accurate touch position. Accordingly,high speed driving of a touch screen panel may be performed.

FIG. 99 is a plan view illustrating a reflection pattern of FIG. 84.FIG. 100 is a plan view illustrating a sensing pattern of FIG. 84. FIG.101 is a plan view illustrating the reflection pattern of FIG. 99 andthe sensing pattern of FIG. 100.

Referring to FIG. 84 and FIGS. 99 to 101, the reflection pattern 4370and the sensing pattern 4390 are illustrated.

The reflection pattern 4370 is disposed only in the reflection regionIII. Thus, the reflection pattern 4370 is not disposed in a region thatthe Pixels 60, 70, and 80 are disposed. The reflection pattern 4370 isprovided as one pattern.

The sensing pattern 4390 is disposed in the light-emitting region II andthe reflection region III. The sensing pattern 4390 may be electricallyconnected to a sensing driver (not shown) through a connection line4395. The connection line 4395 may include the same material as that ofthe sensing pattern 4390. The connection line 4395 may disposed on thesame layer as the sensing pattern 4390. However, the invention is notlimited thereto, and the connection line 4395 may include differentmaterial from the sensing pattern 4390.

The sensing pattern 4390 may function as a sensing electrode of a touchscreen panel of self capacitance type. In an exemplary embodiment, whenan electric conductor is contacted, capacitance of the sensing pattern4390 around a touch position is changed, for example. Thus, a touchpanel sensor (not shown) may decide a touch position based on acapacitance sensing signal corresponding to the change of capacitance.

The sensing pattern 4390 may have a size corresponding to apredetermined number of unit pixels Px. The sensing pattern 4390 mayhave an appropriate size according to a size of a display device.

In the illustrated exemplary embodiment, the sensing patterns 4390classified as a plurality of sensing groups comprising a predeterminednumber of sensing patterns. In an exemplary embodiment, sensing patternsof A group are electrically connected to a first group driver 4510, andsensing patterns of B group are electrically connected to a second groupdriver 4520, for example. The first group driver 4510 and the secondgroup driver 4520 are electrically connected to a sensing driver 4600.

When a touch signal is applied to the sensing patterns 4390, a sensinggroup to which the touch signal is applied is detected, and an accuratetouch position in the sensing group to which the touch signal is appliedis detected. Accordingly, high speed driving of a touch screen panel maybe performed.

FIG. 102 is a plan view illustrating a reflection pattern of FIG. 84.FIG. 103 is a plan view illustrating a sensing pattern of FIG. 84. FIG.104 is a plan view illustrating the reflection pattern of FIG. 102 andthe sensing pattern of FIG. 103.

Referring to FIG. 84 and FIGS. 102 to 104, the reflection pattern 4370and the sensing pattern 4390 are illustrated.

The reflection pattern 4370 is disposed only in the reflection regionIII. Thus, the reflection pattern 4370 is not disposed in a region thatthe Pixels 60, 70, and 80 are disposed. The reflection pattern 4370 maybe electrically connected to a sensing driver (not shown) through afirst connection line 4375. The first connection line 4375 may includethe same material as that of the reflection pattern 4370. The firstconnection line 4375 may disposed on the same layer as the reflectionpattern 4370. However, the invention is not limited thereto, and thefirst connection line 4375 may include different material from thereflection pattern 4370.

The sensing pattern 4390 is disposed in the light-emitting region II andthe reflection region III. The sensing pattern 4390 may be electricallyconnected to a sensing driver (not shown) through a second connectionline 4395. The second connection line 4395 may include the same materialas that of the sensing pattern 4390. The second connection line 4395 maydisposed on the same layer as the sensing pattern 4390. However, theinvention is not limited thereto, and the second connection line 4395may include different material from the sensing pattern 4390.

The sensing pattern 4390 may function as a sensing electrode of a touchscreen panel of self capacitance type. In an exemplary embodiment, whenan electric conductor is contacted, capacitance of the sensing pattern4390 around a touch position is changed, for example. Thus, a touchpanel sensor (not shown) may decide a touch position based on acapacitance sensing signal corresponding to the change of capacitance.

The sensing pattern 4390 may have a size corresponding to apredetermined number of unit pixels Px. The sensing pattern 4390 mayhave an appropriate size according to a size of a display device.

In the illustrated exemplary embodiment, the sensing patterns 4390classified as a plurality of sensing groups comprising a predeterminednumber of sensing patterns. In an exemplary embodiment, sensing patternsof A group are electrically connected to a first group driver 4510, andsensing patterns of B group are electrically connected to a second groupdriver 4520, for example. The first group driver 4510 and the secondgroup driver 4520 are electrically connected to a sensing driver 4600.

When a touch signal is applied to the sensing patterns 4390, a sensinggroup to which the touch signal is applied is detected, and an accuratetouch position in the sensing group to which the touch signal is appliedis detected. Accordingly, high speed driving of a touch screen panel maybe performed.

When a touch signal is applied to the sensing pattern 4390, potentialdifference between the sensing pattern 4390 and the reflection pattern4370 may be occurred. Thus, capacitance between the sensing pattern 4390and the reflection pattern 4370 is occurred, so that touch sensitivitymay be declined due to the capacitance between the sensing pattern 4390and the reflection pattern 4370.

However, in the illustrated exemplary embodiment, when a touch signal isapplied to a sensing pattern 4390, a signal having the same signal asthe touch signal is applied to the reflection pattern 4370. Thus,potential difference between the sensing pattern 4390 and the reflectionpattern 4370 may be not occurred. Thus, capacitance between the sensingpattern 4390 and the reflection pattern 4370 is not occurred, so thatdecline of touch sensitivity may be prevented.

FIG. 105 is a plan view illustrating a reflection pattern of FIG. 84.FIG. 106 is a plan view illustrating a sensing pattern of FIG. 84. FIG.107 is a plan view illustrating the reflection pattern of FIG. 105 andthe sensing pattern of FIG. 106.

Referring to FIG. 84 and FIGS. 105 to 107, the reflection pattern 4370and the sensing pattern 4390 are illustrated.

The reflection pattern 4370 is disposed only in the reflection regionIII. Thus, the reflection pattern 4370 is not disposed in a region thatthe Pixels 60, 70, and 80 are disposed. The reflection pattern 4370 maybe electrically connected to a sensing driver (not shown) through afirst connection line 4375. The first connection line 4375 may includethe same material as that of the reflection pattern 4370. The firstconnection line 4375 may disposed on the same layer as the reflectionpattern 4370. However, the invention is not limited thereto, and thefirst connection line 4375 may include different material from thereflection pattern 4370.

The sensing pattern 4390 is disposed in the light-emitting region II andthe reflection region III. The sensing pattern 4390 may be electricallyconnected to a sensing driver (not shown) through a second connectionline 4395. The second connection line 4395 may include the same materialas that of the sensing pattern 4390. The second connection line 4395 maydisposed on the same layer as the sensing pattern 4390. However, theinvention is not limited thereto, and the second connection line 4395may include different material from the sensing pattern 4390.

The sensing pattern 4390 may function as a sensing electrode of a touchscreen panel of self capacitance type. In an exemplary embodiment, whenan electric conductor is contacted, capacitance of the sensing pattern4390 around a touch position is changed, for example. Thus, a touchpanel sensor (not shown) may decide a touch position based on acapacitance sensing signal corresponding to the change of capacitance.

The sensing pattern 4390 may have a size corresponding to apredetermined number of unit pixels Px. The sensing pattern 4390 mayhave an appropriate size according to a size of a display device.

In the illustrated exemplary embodiment, the sensing patterns 4390classified as a plurality of sensing groups comprising a predeterminednumber of sensing patterns. In an exemplary embodiment, sensing patternsof A group are electrically connected to a first group driver 4510, andsensing patterns of B group are electrically connected to a second groupdriver 4520, for example. The first group driver 4510 and the secondgroup driver 4520 are electrically connected to a sensing driver 4600.

When a touch signal is applied to the sensing patterns 4390, a sensinggroup to which the touch signal is applied is detected, and an accuratetouch position in the sensing group to which the touch signal is appliedis detected. Accordingly, high speed driving of a touch screen panel maybe performed.

In the exemplary embodiment, the reflection pattern 4370 is provided asa size corresponding to one group of the sensing patterns 4390. In anexemplary embodiment, the reflection pattern 4370 may have a sizecorresponding to eight reflection patterns 4370, for example. However,the invention is not limited thereto, and the reflection pattern 4370may have a various size.

When a touch signal is applied to the sensing pattern 4390, potentialdifference between the sensing pattern 4390 and the reflection pattern4370 may be occurred. Thus, capacitance between the sensing pattern 390and the reflection pattern 4370 is occurred, so that touch sensitivitymay be declined due to the capacitance between the sensing pattern 4390and the reflection pattern 4370.

However, in the illustrated exemplary embodiment, when a touch signal isapplied to a sensing pattern 4390, a signal having the same signal asthe touch signal is applied to the reflection pattern 4370. Thus,potential difference between the sensing pattern 4390 and the reflectionpattern 4370 may be not occurred. Thus, capacitance between the sensingpattern 4390 and the reflection pattern 4370 is not occurred, so thatdecline of touch sensitivity may be prevented.

According to the exemplary embodiment, an OLED device includes areflection member having mirror function and touch function. Thus,additional process for forming an electrode layer having a touchfunction may be omitted. This, a manufacturing cost may be decreased.

In addition, the OLED device includes a first reflection member disposedin a reflection region and a second disposed in the light-emittingregion and the reflection region. Thus, scattered reflection occurred atan edge of the first reflection member may be decreased.

In addition, the OLED device includes a thin film encapsulation layer.Thus, a flexible OLED device having mirror function and touch functionmay be manufactured.

The foregoing is illustrative of the invention and is not to beconstrued as limiting thereof. Although a few exemplary embodiments ofthe invention have been described, those skilled in the art will readilyappreciate that many modifications are possible in the exemplaryembodiments without materially departing from the novel teachings andadvantages of the invention. Accordingly, all such modifications areintended to be included within the scope of the invention as defined inthe claims. In the claims, means-plus-function clauses are intended tocover the structures described herein as performing the recited functionand not only structural equivalents but also equivalent structures.Therefore, it is to be understood that the foregoing is illustrative ofthe invention and is not to be construed as limited to the specificexemplary embodiments disclosed, and that modifications to the disclosedexemplary embodiments, as well as other exemplary embodiments, areintended to be included within the scope of the appended claims. Theinvention is defined by the following claims, with equivalents of theclaims to be included therein.

What is claimed is:
 1. An organic light emitting display devicecomprising: a substrate comprising a light-emitting region and areflection region; a plurality of sensing patterns disposed in an areacorresponding to the light-emitting region and the reflection region,and comprising a material having a first reflectivity; and a reflectionpattern disposed in an area corresponding to the reflection region, andcomprising a material having a second reflectivity, and overlapping theplurality of sensing patterns.
 2. The organic light emitting displaydevice of claim 1, further comprising: a plurality of connection linesconnected to the sensing patterns; a sensing driver connected to theconnection lines; and an opposite substrate facing the substrate, andwherein the plurality of sensing patterns is disposed on a first surfaceof the opposite substrate, the plurality of sensing patterns beingdisposed between the substrate and the opposite substrate, and thereflection pattern is disposed on the plurality of sensing patterns, andfurther comprising: an insulation layer disposed between the pluralityof sensing patterns and the reflection pattern.
 3. The organic lightemitting display device of claim 2, wherein the reflection pattern iselectrically connected to the substrate through a conductive adhesivemember.
 4. The organic light emitting display device of claim 1, furthercomprising: a plurality of connection lines connected to the sensingpatterns; a sensing driver connected to the connection lines; and a thinfilm encapsulation layer disposed on the substrate, and wherein theplurality of sensing patterns is disposed on the thin film encapsulationlayer, and the reflection pattern is disposed on the plurality ofsensing patterns, and further comprising: an insulation layer disposedbetween the plurality of sensing patterns and the reflection pattern. 5.The organic light emitting display device of claim 1, furthercomprising: a plurality of connection lines connected to the sensingpatterns; a sensing driver connected to the connection lines; and afirst thin film encapsulation layer disposed on the substrate, andwherein the plurality of sensing patterns is disposed on the first thinfilm encapsulation layer, and the reflection pattern is disposed on theplurality of sensing patterns, and further comprising: a second thinfilm encapsulation layer disposed between the plurality of sensingpatterns and the reflection pattern.
 6. The organic light emittingdisplay device of claim 1, wherein the plurality of sensing patterns isclassified as a plurality of sensing groups comprising a predeterminednumber of sensing patterns of the plurality of sensing patterns, andwhen a touch signal is applied to the plurality of sensing patterns, asensing group of the plurality of sensing groups to which the touchsignal is applied is detected, and an accurate touch position in thesensing group to which the touch signal is applied is detected.
 7. Theorganic light emitting display device of claim 6, when the touch signalis applied to the sensing group, a signal having the same signal as thetouch signal is applied to the reflection pattern.
 8. The organic lightemitting display device of claim 6, wherein the reflection patterncomprises a plurality of sub-reflection patterns having an areacorresponding to an area of one sensing group of the plurality ofsensing groups, and when the touch signal is applied to the sensinggroup, a signal having the same signal as the touch signal is applied toa sub-reflection pattern of the plurality of sub-reflection patternsoverlapping the sensing group to which the touch signal is applied. 9.The organic light emitting display device of claim 1, wherein thereflection pattern comprises a plurality of sub-reflection patternshaving an area corresponding to an area of a predetermined number ofsensing patterns of the plurality of sensing patterns, and wherein asub-reflection pattern of the plurality of sub-reflection patternssenses a touch position of a wide range, and after the sub-reflectionpattern senses the touch position, the sensing pattern senses anaccurate touch position.
 10. The organic light emitting display deviceof claim 1, wherein the reflection pattern comprises a plurality ofsub-reflection patterns having an area corresponding to an area of onesensing pattern, and wherein one sub-reflection pattern of the pluralityof sub-reflection patterns is electrically connected to one sensingpattern.
 11. A method of manufacturing an organic light emitting displaydevice comprising a substrate comprising a light-emitting region and areflection region, the method comprising: forming a plurality of sensingpatterns comprising a material having a first reflectivity on thelight-emitting region and the reflection region; and forming areflection pattern comprising a material having a second reflectivity onthe reflection region, the reflection pattern overlapping the pluralityof sensing patterns.
 12. The method of claim 11, wherein the forming theplurality of sensing patterns and the forming the reflection patterncomprise: forming the plurality of sensing patterns on a first surfaceof an opposite substrate facing the substrate; forming an insulationlayer on the plurality of sensing patterns; and forming the reflectionpattern on the insulation layer, wherein the plurality of sensingpatterns and the reflection pattern are disposed between the substrateand the opposite substrate.
 13. The method of claim 12, furthercomprising: electrically connecting the reflection pattern to thesubstrate by a conductive adhesive member.
 14. The method of claim 11,wherein the forming the plurality of sensing patterns and the formingthe reflection pattern comprise: forming a thin film encapsulation layeron the substrate; forming the plurality of sensing patterns on the thinfilm encapsulation layer; forming an insulation layer on the pluralityof sensing patterns; and forming the reflection pattern on theinsulation layer.
 15. The method of claim 11, wherein the forming theplurality of sensing patterns and the forming the reflection patterncomprise: forming a first thin film encapsulation layer on thesubstrate; forming the plurality of sensing patterns on the first thinfilm encapsulation layer; forming a second thin film encapsulation layercomprising the same material as that of the first thin filmencapsulation layer on the plurality of sensing patterns; and formingthe reflection pattern on the second thin film encapsulation layer. 16.The method of claim 11, wherein the plurality of sensing patterns isclassified as a plurality of sensing groups comprising a predeterminednumber of sensing patterns of the plurality of sensing patterns, andwhen a touch signal is applied to the plurality of sensing patterns, asensing group of the plurality of sensing groups to which the touchsignal is applied is detected, and an accurate touch position in thesensing group to which the touch signal is applied is detected.
 17. Themethod of claim 16, when the touch signal is applied to the sensinggroup, a signal having the same signal as the touch signal is applied tothe reflection pattern.
 18. The method of claim 16, wherein thereflection pattern comprises a plurality of sub-reflection patternshaving an area corresponding to an area of one sensing group of theplurality of sensing groups, and when the touch signal is applied to thesensing group, a signal having the same signal as the touch signal isapplied to a sub-reflection pattern of the plurality of sub-reflectionpatterns overlapping the sensing group to which the touch signal isapplied.
 19. The method of claim 11, wherein the reflection patterncomprises a plurality of sub-reflection patterns having an areacorresponding to an area of a predetermined number of sensing patternsof the plurality of sensing patterns, and wherein a sub-reflectionpattern of the plurality of sub-reflection patterns senses a touchposition of a wide range, and after the sub-reflection pattern sensesthe touch position, the plurality of sensing pattern senses an accuratetouch position.
 20. The method of claim 11, wherein the reflectionpattern comprises a plurality of sub-reflection patterns having an areacorresponding to an area of one sensing pattern, and wherein onesub-reflection pattern of the plurality of sub-reflection patterns iselectrically connected to one sensing pattern.